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LPC2470
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface
Rev. 02 -- 15 October 2009 Preliminary data sheet
1. General description
NXP Semiconductors designed the LPC2470 microcontroller, powered by the ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of applications that require advanced communications and high quality graphic displays. The LPC2470 microcontroller is flashless. The LPC2470, with real-time debug interfaces that include both JTAG and embedded trace, can execute both 32-bit ARM and 16-bit Thumb instructions. The LPC2470 microcontroller incorporates an LCD controller, a 10/100 Ethernet Media Access Controller (MAC), a USB full-speed device/host/OTG controller with 4 kB of endpoint RAM, four UARTs, two Controller Area Network (CAN) channels, an SPI interface, two Synchronous Serial Ports (SSP), three I2C interfaces, and an I2S interface. Supporting this collection of serial communications interfaces are the following feature components; an on-chip 4 MHz internal oscillator, 98 kB of total RAM consisting of 64 kB of local SRAM, 16 kB SRAM for Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of battery powered SRAM, and an External Memory Controller (EMC). These features make this device optimally suited for portable electronics and Point-of-Sale (POS) applications. Complementing the many serial communication controllers, versatile clocking capabilities, and memory features are various 32-bit timers, a 10-bit ADC, 10-bit DAC, two PWM units, and up to 160 fast GPIO lines. The LPC2470 connects 64 of the GPIO pins to the hardware based Vector Interrupt Controller (VIC) that means these external inputs can generate edge-triggered interrupts. All of these features make the LPC2470 particularly suitable for industrial control and medical systems.
2. Features
I ARM7TDMI-S processor, running at up to 72 MHz. I 98 kB on-chip SRAM includes: N 64 kB of SRAM on the ARM local bus for high performance CPU access. N 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM. N 16 kB SRAM for general purpose DMA use also accessible by the USB. N 2 kB SRAM data storage powered from the Real-Time Clock (RTC) power domain. I LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film Transistors (TFT) displays. N Dedicated DMA controller. N Selectable display resolution (up to 1024 x 768 pixels). N Supports up to 24-bit true-color mode. I Dual Advanced High-performance Bus (AHB) system allows simultaneous Ethernet DMA, and USB DMA with no contention.
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
I EMC provides support for asynchronous static memory devices such as RAM, ROM and flash, as well as dynamic memories such as single data rate SDRAM. I Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts. I General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP, I2S-bus, and Secure Digital/MultiMediaCard (SD/MMC) interface as well as for memory-to-memory transfers. I Serial Interfaces: N Ethernet MAC with MII/RMII interface and associated DMA controller. These functions reside on an independent AHB. N USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and associated DMA controller. N Four UARTs with fractional baud rate generation, one with modem control I/O, one with IrDA support, all with FIFO. N CAN controller with two channels. N SPI controller. N Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate for the SPI port, sharing its interrupt. SSPs can be used with the GPDMA controller. N Three I2C-bus interfaces (one with open-drain and two with standard port pins). N I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with the GPDMA. I Other peripherals: N SD/MMC memory card interface. N 160 General purpose I/O pins with configurable pull-up/down resistors. N 10-bit ADC with input multiplexing among 8 pins. N 10-bit DAC. N Four general purpose timers/counters with 8 capture inputs and 10 compare outputs. Each timer block has an external count input. N Two PWM/timer blocks with support for three-phase motor control. Each PWM has an external count inputs. N RTC with separate power domain. Clock source can be the RTC oscillator or the APB clock. N 2 kB SRAM powered from the RTC power pin, allowing data to be stored when the rest of the chip is powered off. N WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock. I Single 3.3 V power supply (3.0 V to 3.6 V). I 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as the system clock. I Four reduced power modes: idle, sleep, power-down, and deep power-down. I Four external interrupt inputs configurable as edge/level sensitive. All pins on port 0 and port 2 can be used as edge sensitive interrupt sources. I Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt, CAN bus activity, port 0/2 pin interrupt). I Two independent power domains allow fine tuning of power consumption based on needed features.
LPC2470_2 (c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
2 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
I Each peripheral has its own clock divider for further power saving. These dividers help reduce active power by 20 % to 30 %. I Brownout detect with separate thresholds for interrupt and forced reset. I On-chip power-on reset. I On-chip crystal oscillator with an operating range of 1 MHz to 24 MHz. I On-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the RTC oscillator. I Boundary scan for simplified board testing. I Versatile pin function selections allow more possibilities for using on-chip peripheral functions. I Standard ARM test/debug interface for compatibility with existing tools. I Emulation trace module supports real-time trace.
3. Applications
I I I I Industrial control Medical systems Portable electronics Point-of-Sale (POS) equipment
4. Ordering information
Table 1. Ordering information Package Name LPC2470FBD208 LQFP208 Description plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm Version SOT459-1 SOT950-1 Type number
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
4.1 Ordering options
Table 2. Ordering options Flash (kB) Local bus SRAM (kB) Ethernet buffer External Ethernet USB bus OTG/ OHCI/ device + 4 kB FIFO SD/ GP MMC DMA CAN channels ADC channels yes yes 8 yes yes 8 DAC channels 1 -40 C to +85 C -40 C to +85 C 1
3 of 83
Type number
Temp range
GP/USB
LPC2470FBD208 n/a
64
16
16
2
98 Full 32-bit 98 Full 32-bit
Total
RTC
MII/RMII
yes
2
LPC2470FET208
n/a
64
16
16
2
MII/RMII
yes
2
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
5. Block diagram
XTAL1 VDD(3V3) XTAL2 VDDA
TMS TDI
trace signals
TRST TCK TDO EXTIN0 DBGEN
RESET VREF VSSA, VSSCORE, VSSIO VDD(DCDC)(3V3)
TEST/DEBUG INTERFACE
EMULATION TRACE MODULE
P0, P1, P2, P3, P4
LPC2470
64 kB SRAM
PLL system clock
SYSTEM FUNCTIONS INTERNAL RC OSCILLATOR
HIGH-SPEED GPIO 160 PINS TOTAL
INTERNAL SRAM CONTROLLER
ARM7TDMI-S
VIC
16 kB SRAM
EXTERNAL MEMORY CONTROLLER AHB1
D[31:0] A[23:0] control lines
AHB2
AHB BRIDGE
AHB BRIDGE USB DEVICE/ HOST/OTG WITH 4 kB RAM AND DMA GP DMA CONTROLLER LCD INTERFACE WITH DMA 8 x LCD control LCDVD[23:0] LCDCLKIN VBUS port1 port2
MII/RMII
ETHERNET MAC WITH DMA
16 kB SRAM
MASTER AHB TO SLAVE PORT AHB BRIDGE PORT AHB TO APB BRIDGE
EINT3 to EINT0 P0, P2 2 x CAP0/CAP1/ CAP2/CAP3 4 x MAT2/MAT3, 2 x MAT0, 3 x MAT1 6 x PWM0/PWM1 1 x PCAP0, 2 x PCAP1 P0, P1
EXTERNAL INTERRUPTS CAPTURE/COMPARE TIMER0/TIMER1/ TIMER2/TIMER3
I2S INTERFACE PWM0, PWM1 SPI, SSP0 INTERFACE LEGACY GPI/O 64 PINS TOTAL SSP1 INTERFACE
3 x I2SRX 3 x I2STX SCK, SCK0 MOSI, MOSI0 MISO, MISO0 SSEL, SSEL0 SCK1 MOSI1 MISO1 SSEL1 MCICLK, MCIPWR MCICMD, MCIDAT[3:0] TXD0, TXD2, TXD3 RXD0, RXD2, RXD3 TXD1, DTR1, RTS1 RXD1, DSR1, CTS1, DCD1, RI1 RD1, RD2 TD1, TD2 SCL0, SCL1, SCL2 SDA0, SDA1, SDA2
8 x AD0
A/D CONVERTER SD/MMC CARD INTERFACE
AOUT VBAT power domain 2 RTCX1 RTCX2 ALARM
D/A CONVERTER
2 kB BATTERY RAM
UART0, UART2, UART3
RTC OSCILLATOR
REALTIME CLOCK
UART1
CAN1, CAN2 WATCHDOG TIMER SYSTEM CONTROL I2C0, I2C1, I2C2
002aad317
Fig 1. LPC2470 block diagram
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
4 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
6. Pinning information
6.1 Pinning
208 157 156 105 104 4 3 5 6 7 8 9 53
002aad318
1
LPC2470FBD208
52
Fig 2. LPC2470 pinning LQFP208 package
ball A1 index area 1 A B C D E F G H J K L M N P R T U
2
10 12 14 16 11 13 15 17
LPC2470FET208
002aad319
Transparent top view
Fig 3. LPC2470 pinning TFBGA208 package Table 3. Row A 1 5 P3[27]/D27/ CAP1[0]/PWM1[4] P1[4]/ENET_TX_EN 2 6 VSSIO P1[9]/ENET_RXD0 3 7 P1[0]/ENET_TXD0 P1[14]/ENET_RX_ER 4 8 P4[31]/CS1 P1[15]/ ENET_REF_CLK/ ENET_RX_CLK VSSIO Pin allocation table Pin Symbol Pin Symbol Pin Symbol
Pin Symbol
9
P1[17]/ENET_MDIO
10
P1[3]/ENET_TXD3/ MCICMD/PWM0[2]
11
P4[15]/A15
12
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
5 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 3. 13
Pin allocation table ...continued Pin Symbol 14 P1[11]/ENET_RXD2/ MCIDAT2/PWM0[6] Pin Symbol 15 P0[8]/I2STX_WS/ LCDVD[16]/MISO1/ MAT2[2] Pin Symbol 16 P1[12]/ENET_RXD3/ MCIDAT3/PCAP0[0] -
Pin Symbol P3[20]/D20/ PWM0[5]/DSR1 P1[5]/ENET_TX_ER/ MCIPWR/PWM0[3] P3[2]/D2 P1[1]/ENET_TXD1 P4[25]/WE
17
Row B 1 5 9 2 6 10 P3[10]/D10 VSSIO P4[29]/BLS3/MAT2[1]/ LCDVD[7]/LCDVD[11]/ LCDVD[3]/RXD3 P3[19]/D19/ PWM0[4]/DCD1 3 7 11 P3[1]/D1 P4[30]/CS0 P1[6]/ENET_TX_CLK/ MCIDAT0/PWM0[4] P4[14]/A14 4 8 12 P3[0]/D0 P4[24]/OE P0[4]/I2SRX_CLK/ LCDVD[0]/RD2/CAP2[0] P4[13]/A13 -
13 17
VDD(3V3) P2[0]/PWM1[1]/TXD1/ TRACECLK/LCDPWR P3[13]/D13 P3[9]/D9 VDD(3V3)
14
15
16
Row C 1 5 9 2 6 10 TDI P3[22]/D22/ PCAP0[0]/RI1 P3[21]/D21/ PWM0[6]/DTR1 P0[9]/I2STX_SDA/ LCDVD[17]/MOSI1/ MAT2[3] 2 6 10 14 P3[28]/D28/ CAP1[1]/PWM1[5] P0[3]/RXD0 P1[16]/ENET_MDC P1[7]/ENET_COL/ MCIDAT1/PWM0[5] 3 7 11 15 3 7 11 RTCK 4 P0[2]/TXD0 P1[10]/ENET_RXD1 P0[5]/I2SRX_WS/ LCDVD[1]/TD2/CAP2[1] P4[12]/A12 P1[8]/ENET_CRS_DV/E 8 NET_CRS P4[28]/BLS2/MAT2[0]/ LCDVD[6]/LCDVD[10]/ LCDVD[2]/TXD3 P3[18]/D18/ PWM0[3]/CTS1 TDO VDD(3V3) VDD(DCDC)(3V3) P2[2]/PWM1[3]/CTS1/ PIPESTAT1/LCDDCLK 4 8 12 16 12
13
P0[7]/I2STX_CLK/ LCDVD[9]/SCK1/ MAT2[1] VDD(3V3) TRST P3[11]/D11 P1[2]/ENET_TXD2/ MCICLK/PWM0[1] P0[6]/I2SRX_SDA/ LCDVD[8]/SSEL1/ MAT2[0] P2[4]/PWM1[5]/ DSR1/TRACESYNC/ LCDENAB/LCDM P0[26]/AD0[3]/ AOUT/RXD3 P2[1]/PWM1[2]/RXD1/ PIPESTAT0/LCDLE
14
15
16
17 1 5 9 13
P3[12]/D12 P3[8]/D8 VSSCORE P1[13]/ENET_RX_DV
Row D
17
-
Row E 1 14 2 15 TCK VSSIO 3 16 TMS P2[3]/PWM1[4]/DCD1/ PIPESTAT2/LCDFP 4 17 P3[3]/D3 P2[6]/PCAP1[0]/RI1/ TRACEPKT1/ LCDVD[0]/LCDVD[4] DBGEN
Row F 1 P0[25]/AD0[2]/ I2SRX_SDA/TXD3 2 P3[4]/D4 3 P3[29]/D29/ MAT1[0]/PWM1[6] 4
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
6 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 3. 14
Pin allocation table ...continued Pin Symbol 15 P3[17]/D17/ PWM0[2]/RXD1 Pin Symbol 16 P2[5]/PWM1[6]/ DTR1/TRACEPKT0/ LCDLP VDD(3V3) P2[7]/RD2/ RTS1/TRACEPKT2/ LCDVD[1]/LCDVD[5] P3[30]/D30/ MAT1[1]/RTS1 P2[9]/ USB_CONNECT1/ RXD2/EXTIN0/ LCDVD[3]/LCDVD[7] P3[31]/D31/MAT1[2] P0[15]/TXD1/ SCK0/SCK RSTOUT VDD(3V3) Pin Symbol 17 P3[16]/D16/ PWM0[1]/TXD1
Pin Symbol P4[11]/A11
Row G 1 14 P3[5]/D5 n.c. 2 15 P0[24]/AD0[1]/ I2SRX_WS/CAP3[1] P4[27]/BLS1 3 16 4 17 VDDA P4[10]/A10
Row H 1 14 P0[23]/AD0[0]/ I2SRX_CLK/CAP3[0] VSSIO 2 15 P3[14]/D14 P2[8]/TD2/TXD2/ TRACEPKT3/ LCDVD[2]/LCDVD[6] 3 16 4 17 VDD(DCDC)(3V3) P4[9]/A9
Row J 1 14 P3[6]/D6 P0[16]/RXD1/ SSEL0/SSEL VREF P4[22]/A22/ TXD2/MISO1 P3[7]/D7 n.c. 2 15 VSSA P4[23]/A23/ RXD2/MOSI1 RTCX1 P0[18]/DCD1/ MOSI0/MOSI RTCX2 P4[26]/BLS0 3 16 4 17 n.c. P4[8]/A8
Row K 1 14 2 15 3 16 4 17 VSSCORE P0[17]/CTS1/ MISO0/MISO P2[30]/DQMOUT2/ MAT3[2]/SDA2 P0[19]/DSR1/ MCICLK/SDA1 XTAL1 P0[20]/DTR1/ MCICMD/SCL1 XTAL2 P0[22]/RTS1/ MCIDAT0/TD1
Row L 1 14 2 15 3 16 VSSIO P4[7]/A7 4 17
Row M 1 14 P3[15]/D15 P4[6]/A6 2 15 RESET P4[21]/A21/ SCL2/SSEL1 P2[31]/DQMOUT3/ MAT3[3]/SCL2 P2[10]/EINT0 3 16 VBAT P0[21]/RI1/ MCIPWR/RD1 P2[29]/DQMOUT1 VSSIO 4 17
Row N 1 14 ALARM P2[12]/EINT2/ LCDVD[4]/LCDVD[8]/ LCDVD[3]/LCDVD[18]/ MCIDAT2/I2STX_WS P1[31]/USB_OVRCR2/ SCK1/AD0[5] P2[24]/CKEOUT0 2 15 3 16 4 17
Row P 1 5 2 6 P1[30]/USB_PWRD2/ VBUS/AD0[4] VDD(3V3) 3 7 P2[27]/CKEOUT3/ MAT3[1]/MOSI0 4 P2[28]/DQMOUT0 VDD(3V3)
P1[18]/USB_UP_LED1/ 8 PWM1[1]/CAP1[0]
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
7 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 3. 9
Pin allocation table ...continued Pin Symbol 10 VSSCORE Pin Symbol 11 VDD(DCDC)(3V3) Pin Symbol 12 VSSIO
Pin Symbol P1[23]/USB_RX_DP1/ LCDVD[9]/LCDVD[13]/ PWM1[4]/MISO0 P2[15]/CS3/ CAP2[1]/SCL1 VDD(3V3) P0[12]/USB_PPWR2/ MISO1/AD0[6] P3[24]/D24/ CAP0[1]/PWM1[1] VSSIO
13 17 1 5
14
P4[17]/A17 -
15
P4[18]/A18 P0[28]/SCL0 P2[19]/CLKOUT1
16
P4[19]/A19 -
Row R 2 6 P0[13]/USB_UP_LED2/ 3 MOSI1/AD0[7] P0[30]/USB_D-1 7 4 8 P2[25]/CKEOUT1 P1[21]/USB_TX_DM1/ LCDVD[7]/LCDVD[11]/ PWM1[3]/SSEL0 P2[14]/CS2/CAP2[0]/ SDA1 P4[5]/A5 4 8 P2[26]/CKEOUT2/ MAT3[0]/MISO0 P2[20]/DYCS0
9
10
P1[26]/USB_SSPND1/ 11 LCDVD[12]/LCDVD[20]/ PWM1[6]/CAP0[0] P0[11]/RXD2/SCL2/ MAT3[1] 15
P2[16]/CAS
12
13 17 1 5
P2[17]/RAS P4[20]/A20/SDA2/SCK1 P0[27]/SDA0 VSSIO
14
P4[4]/A4 -
16
Row T 2 6 P0[31]/USB_D+2 P3[23]/D23/ CAP0[0]/PCAP1[0] 3 7 P3[26]/D26/ MAT0[1]/PWM1[3] P0[14]/USB_HSTEN2/ USB_CONNECT2/ SSEL1 P4[2]/A2
9
P1[24]/USB_RX_DM1/ 10 LCDVD[10]/LCDVD[14]/ PWM1[5]/MOSI0 P1[28]/USB_SCL1/ 14 LCDVD[14]/LCDVD[22]/ PCAP1[0]/MAT0[0] P2[11]/EINT1/ LCDCLKIN/ MCIDAT1/I2STX_CLK USB_D-2 P2[23]/DYCS3/ CAP3[1]/SSEL0 P4[0]/A0 VDD(3V3) 2 6
P1[25]/USB_LS1/ 11 LCDVD[11]/LCDVD[15]/ USB_HSTEN1/MAT1[1] P0[1]/TD1/RXD3/SCL1 15
12
P1[27]/USB_INT1/ LCDVD[13]/LCDVD[21]/ USB_OVRCR1/CAP0[1] P2[13]/EINT3/ LCDVD[5]/LCDVD[9]/ LCDVD[19]/MCIDAT3/ I2STX_SDA -
13
P0[10]/TXD2/SDA2/ MAT3[0]
16
17
-
-
Row U 1 5 P3[25]/D25/ MAT0[0]/PWM1[2] P1[19]/USB_TX_E1/ USB_PPWR1/CAP1[1] P4[1]/A1 3 7 P2[18]/CLKOUT0 P1[20]/USB_TX_DP1/ LCDVD[6]/LCDVD[10]/ PWM1[2]/SCK0 P2[21]/DYCS1 P0[0]/RD1/TXD3/SDA1 4 8 P0[29]/USB_D+1 P1[22]/USB_RCV1/ LCDVD[8]/LCDVD[12]/ USB_PWRD1/MAT1[0] P2[22]/DYCS2/ CAP3[0]/SCK0 P4[3]/A3
9 13
10 14
11
12 16
P1[29]/USB_SDA1/ 15 LCDVD[15]/LCDVD[23]/ PCAP1[1]/MAT0[1] -
17
P4[16]/A16
-
-
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
8 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
6.2 Pin description
Table 4. Symbol P0[0] to P0[31] Pin description Pin Ball Type I/O Description Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the pin connect block. P0[0] -- General purpose digital input/output pin. RD1 -- CAN1 receiver input. TXD3 -- Transmitter output for UART3. SDA1 -- I2C1 data input/output (this is not an open-drain pin). P0[1] -- General purpose digital input/output pin. TD1 -- CAN1 transmitter output. RXD3 -- Receiver input for UART3. SCL1 -- I2C1 clock input/output (this is not an open-drain pin). P0[2] -- General purpose digital input/output pin. TXD0 -- Transmitter output for UART0. P0[3] -- General purpose digital input/output pin. RXD0 -- Receiver input for UART0. P0[4] -- General purpose digital input/output pin. I2SRX_CLK -- I2S Receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification.[2] LCDVD[0] -- LCD data.[2] RD2 -- CAN2 receiver input. CAP2[0] -- Capture input for Timer 2, channel 0. P0[5] -- General purpose digital input/output pin. I2SRX_WS -- I2S Receive word select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification.[2] LCDVD[1] -- LCD data.[2] TD2 -- CAN2 transmitter output. CAP2[1] -- Capture input for Timer 2, channel 1. P0[6] -- General purpose digital input/output pin. I2SRX_SDA -- I2S Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification.[2] LCDVD[8] -- LCD data.[2] SSEL1 -- Slave Select for SSP1. MAT2[0] -- Match output for Timer 2, channel 0.
P0[0]/RD1/TXD3/ SDA1
94[1]
U15[1]
I/O I O I/O
P0[1]/TD1/RXD3/ SCL1
96[1]
T14[1]
I/O O I I/O
P0[2]/TXD0 P0[3]/RXD0 P0[4]/I2SRX_CLK/ LCDVD[0]/RD2/ CAP2[0]
202[1] 204[1] 168[1]
C4[1] D6[1] B12[1]
I/O O I/O I I/O I/O
O I I P0[5]/I2SRX_WS/ LCDVD[1]/TD2/ CAP2[1] 166[1] C12[1] I/O I/O
O O I P0[6]/I2SRX_SDA/ LCDVD[8]/ SSEL1/MAT2[0] 164[1] D13[1] I/O I/O
O I/O O
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
9 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 162[1] Ball C13[1] Type I/O I/O Description P0[7] -- General purpose digital input/output pin. I2STX_CLK -- I2S transmit clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification.[2] LCDVD[9] -- LCD data.[2] SCK1 -- Serial Clock for SSP1. MAT2[1] -- Match output for Timer 2, channel 1. P0[8] -- General purpose digital input/output pin. I2STX_WS -- I2S Transmit word select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification.[2] LCDVD[16] -- LCD data.[2] MISO1 -- Master In Slave Out for SSP1. MAT2[2] -- Match output for Timer 2, channel 2. P0[9] -- General purpose digital input/output pin. I2STX_SDA -- I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification.[2] LCDVD[17] -- LCD data.[2] MOSI1 -- Master Out Slave In for SSP1. MAT2[3] -- Match output for Timer 2, channel 3. P0[10] -- General purpose digital input/output pin. TXD2 -- Transmitter output for UART2. SDA2 -- I2C2 data input/output (this is not an open-drain pin). MAT3[0] -- Match output for Timer 3, channel 0. P0[11] -- General purpose digital input/output pin. RXD2 -- Receiver input for UART2. SCL2 -- I2C2 clock input/output (this is not an open-drain pin). MAT3[1] -- Match output for Timer 3, channel 1. P0[12] -- General purpose digital input/output pin. USB_PPWR2 -- Port Power enable signal for USB port 2. MISO1 -- Master In Slave Out for SSP1. AD0[6] -- A/D converter 0, input 6. P0[13] -- General purpose digital input/output pin. USB_UP_LED2 -- USB port 2 GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. MOSI1 -- Master Out Slave In for SSP1. AD0[7] -- A/D converter 0, input 7.
P0[7]/I2STX_CLK/ LCDVD[9]/SCK1/ MAT2[1]
O I/O O P0[8]/I2STX_WS/ LCDVD[16]/ MISO1/MAT2[2] 160[1] A15[1] I/O I/O
O I/O O P0[9]/I2STX_SDA/ LCDVD[17]/ MOSI1/MAT2[3] 158[1] C14[1] I/O I/O
O I/O O P0[10]/TXD2/ SDA2/MAT3[0] 98[1] T15[1] I/O O I/O O P0[11]/RXD2/ SCL2/MAT3[1] 100[1] R14[1] I/O I I/O O P0[12]/ USB_PPWR2/ MISO1/AD0[6] 41[3] R1[3] I/O O I/O I P0[13]/ USB_UP_LED2/ MOSI1/AD0[7] 45[3] R2[3] I/O O
I/O I
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
10 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 69[1] Ball T7[1] Type I/O O O Description P0[14] -- General purpose digital input/output pin. USB_HSTEN2 -- Host Enabled status for USB port 2. USB_CONNECT2 -- SoftConnect control for USB port 2. Signal used to switch an external 1.5 k resistor under software control. Used with the SoftConnect USB feature. SSEL1 -- Slave Select for SSP1. P0[15] -- General purpose digital input/output pin. TXD1 -- Transmitter output for UART1. SCK0 -- Serial clock for SSP0. SCK -- Serial clock for SPI. P0 [16] -- General purpose digital input/output pin. RXD1 -- Receiver input for UART1. SSEL0 -- Slave Select for SSP0. SSEL -- Slave Select for SPI. P0[17] -- General purpose digital input/output pin. CTS1 -- Clear to Send input for UART1. MISO0 -- Master In Slave Out for SSP0. MISO -- Master In Slave Out for SPI. P0[18] -- General purpose digital input/output pin. DCD1 -- Data Carrier Detect input for UART1. MOSI0 -- Master Out Slave In for SSP0. MOSI -- Master Out Slave In for SPI. P0[19] -- General purpose digital input/output pin. DSR1 -- Data Set Ready input for UART1. MCICLK -- Clock output line for SD/MMC interface. SDA1 -- I2C1 data input/output (this is not an open-drain pin). P0[20] -- General purpose digital input/output pin. DTR1 -- Data Terminal Ready output for UART1. MCICMD -- Command line for SD/MMC interface. SCL1 -- I2C1 clock input/output (this is not an open-drain pin). P0[21] -- General purpose digital input/output pin. RI1 -- Ring Indicator input for UART1. MCIPWR -- Power Supply Enable for external SD/MMC power supply. RD1 -- CAN1 receiver input. P0[22] -- General purpose digital input/output pin. RTS1 -- Request to Send output for UART1. MCIDAT0 -- Data line 0 for SD/MMC interface. TD1 -- CAN1 transmitter output.
P0[14]/ USB_HSTEN2/ USB_CONNECT2/ SSEL1
I/O P0[15]/TXD1/ SCK0/SCK 128[1] J16[1] I/O O I/O I/O P0[16]/RXD1/ SSEL0/SSEL 130[1] J14[1] I/O I I/O I/O P0[17]/CTS1/ MISO0/MISO 126[1] K17[1] I/O I I/O I/O P0[18]/DCD1/ MOSI0/MOSI 124[1] K15[1] I/O I I/O I/O P0[19]/DSR1/ MCICLK/SDA1 122[1] L17[1] I/O I O I/O P0[20]/DTR1/ MCICMD/SCL1 120[1] M17[1] I/O O I/O I/O P0[21]/RI1/ MCIPWR/RD1 118[1] M16[1] I/O I O I P0[22]/RTS1/ MCIDAT0/TD1 116[1] N17[1] I/O O I/O O
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
11 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 18[3] Ball H1[3] Type I/O I I/O I Description P0[23] -- General purpose digital input/output pin. AD0[0] -- A/D converter 0, input 0. I2SRX_CLK -- Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. CAP3[0] -- Capture input for Timer 3, channel 0. P0[24] -- General purpose digital input/output pin. AD0[1] -- A/D converter 0, input 1. I2SRX_WS -- Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. CAP3[1] -- Capture input for Timer 3, channel 1. P0[25] -- General purpose digital input/output pin. AD0[2] -- A/D converter 0, input 2. I2SRX_SDA -- Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. TXD3 -- Transmitter output for UART3. P0[26] -- General purpose digital input/output pin. AD0[3] -- A/D converter 0, input 3. AOUT -- D/A converter output. RXD3 -- Receiver input for UART3. P0[27] -- General purpose digital input/output pin. SDA0 -- I2C0 data input/output. Open-drain output (for I2C-bus compliance). P0[28] -- General purpose digital input/output pin. SCL0 -- I2C0 clock input/output. Open-drain output (for I2C-bus compliance). P0[29] -- General purpose digital input/output pin. USB_D+1 -- USB port 1 bidirectional D+ line. P0[30] -- General purpose digital input/output pin. USB_D-1 -- USB port 1 bidirectional D- line. P0[31] -- General purpose digital input/output pin. USB_D+2 -- USB port 2 bidirectional D+ line. Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. P1[0] -- General purpose digital input/output pin. ENET_TXD0 -- Ethernet transmit data 0 (RMII/MII interface). P1[1] -- General purpose digital input/output pin. ENET_TXD1 -- Ethernet transmit data 1 (RMII/MII interface). P1[2] -- General purpose digital input/output pin. ENET_TXD2 -- Ethernet transmit data 2 (MII interface). MCICLK -- Clock output line for SD/MMC interface. PWM0[1] -- Pulse Width Modulator 0, output 1.
(c) NXP B.V. 2009. All rights reserved.
P0[23]/AD0[0]/ I2SRX_CLK/ CAP3[0]
P0[24]/AD0[1]/ I2SRX_WS/ CAP3[1]
16[3]
G2[3]
I/O I I/O
I P0[25]/AD0[2]/ I2SRX_SDA/ TXD3 14[3] F1[3] I/O I I/O O P0[26]/AD0[3]/ AOUT/RXD3 12[3][4] E1[3][4] I/O I O I P0[27]/SDA0 50[5] T1[5] I/O I/O P0[28]/SCL0 48[5] R3[5] I/O I/O P0[29]/USB_D+1 P0[30]/USB_D-1 P0[31]/USB_D+2 P1[0] to P1[31] 61[6] 62[6] 51[6] U4[6] R6[6] T2[6] I/O I/O I/O I/O I/O I/O I/O
P1[0]/ ENET_TXD0 P1[1]/ ENET_TXD1 P1[2]/ ENET_TXD2/ MCICLK/ PWM0[1]
196[1] 194[1] 185[1]
A3[1] B5[1] D9[1]
I/O O I/O O I/O O O O
LPC2470_2
Preliminary data sheet
Rev. 02 -- 15 October 2009
12 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 177[1] Ball A10[1] Type I/O O I/O O 192[1] 156[1] A5[1] A17[1] I/O O I/O O O O 171[1] B11[1] I/O I I/O O 153[1] D14[1] I/O I I/O O 190[1] C7[1] I/O I 188[1] 186[1] 163[1] A6[1] C8[1] A14[1] I/O I I/O I I/O I I/O O 157[1] A16[1] I/O I I/O I 147[1] 184[1] 182[1] D16[1] A7[1] A8[1] I/O I I/O I I/O I Description P1[3] -- General purpose digital input/output pin. ENET_TXD3 -- Ethernet transmit data 3 (MII interface). MCICMD -- Command line for SD/MMC interface. PWM0[2] -- Pulse Width Modulator 0, output 2. P1[4] -- General purpose digital input/output pin. ENET_TX_EN -- Ethernet transmit data enable (RMII/MII interface). P1[5] -- General purpose digital input/output pin. ENET_TX_ER -- Ethernet Transmit Error (MII interface). MCIPWR -- Power Supply Enable for external SD/MMC power supply. PWM0[3] -- Pulse Width Modulator 0, output 3. P1[6] -- General purpose digital input/output pin. ENET_TX_CLK -- Ethernet Transmit Clock (MII interface). MCIDAT0 -- Data line 0 for SD/MMC interface. PWM0[4] -- Pulse Width Modulator 0, output 4. P1[7] -- General purpose digital input/output pin. ENET_COL -- Ethernet Collision detect (MII interface). MCIDAT1 -- Data line 1 for SD/MMC interface. PWM0[5] -- Pulse Width Modulator 0, output 5. P1[8] -- General purpose digital input/output pin. ENET_CRS_DV/ENET_CRS -- Ethernet Carrier Sense/Data Valid (RMII interface)/ Ethernet Carrier Sense (MII interface). P1[9] -- General purpose digital input/output pin. ENET_RXD0 -- Ethernet receive data 0 (RMII/MII interface). P1[10] -- General purpose digital input/output pin. ENET_RXD1 -- Ethernet receive data 1 (RMII/MII interface). P1[11] -- General purpose digital input/output pin. ENET_RXD2 -- Ethernet Receive Data 2 (MII interface). MCIDAT2 -- Data line 2 for SD/MMC interface. PWM0[6] -- Pulse Width Modulator 0, output 6. P1[12] -- General purpose digital input/output pin. ENET_RXD3 -- Ethernet Receive Data (MII interface). MCIDAT3 -- Data line 3 for SD/MMC interface. PCAP0[0] -- Capture input for PWM0, channel 0. P1[13] -- General purpose digital input/output pin. ENET_RX_DV -- Ethernet Receive Data Valid (MII interface). P1[14] -- General purpose digital input/output pin. ENET_RX_ER -- Ethernet receive error (RMII/MII interface). P1[15] -- General purpose digital input/output pin. ENET_REF_CLK/ENET_RX_CLK -- Ethernet Reference Clock (RMII interface)/ Ethernet Receive Clock (MII interface).
P1[3]/ ENET_TXD3/ MCICMD/ PWM0[2] P1[4]/ ENET_TX_EN P1[5]/ ENET_TX_ER/ MCIPWR/ PWM0[3] P1[6]/ ENET_TX_CLK/ MCIDAT0/ PWM0[4] P1[7]/ ENET_COL/ MCIDAT1/ PWM0[5] P1[8]/ ENET_CRS_DV/ ENET_CRS P1[9]/ ENET_RXD0 P1[10]/ ENET_RXD1 P1[11]/ ENET_RXD2/ MCIDAT2/ PWM0[6] P1[12]/ ENET_RXD3/ MCIDAT3/ PCAP0[0] P1[13]/ ENET_RX_DV P1[14]/ ENET_RX_ER P1[15]/ ENET_REF_CLK/ ENET_RX_CLK
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
13 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 180[1] 178[1] 66[1] Ball D10[1] A9[1] P7[1] Type I/O O I/O I/O I/O O Description P1[16] -- General purpose digital input/output pin. ENET_MDC -- Ethernet MIIM clock. P1[17] -- General purpose digital input/output pin. ENET_MDIO -- Ethernet MIIM data input and output. P1[18] -- General purpose digital input/output pin. USB_UP_LED1 -- USB port 1 GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. PWM1[1] -- Pulse Width Modulator 1, channel 1 output. CAP1[0] -- Capture input for Timer 1, channel 0. P1[19] -- General purpose digital input/output pin. USB_TX_E1 -- Transmit Enable signal for USB port 1 (OTG transceiver). USB_PPWR1 -- Port Power enable signal for USB port 1. CAP1[1] -- Capture input for Timer 1, channel 1. P1[20] -- General purpose digital input/output pin. USB_TX_DP1 -- D+ transmit data for USB port 1 (OTG transceiver).[7] LCDVD[6]/LCDVD[10] -- LCD data.[7] PWM1[2] -- Pulse Width Modulator 1, channel 2 output. SCK0 -- Serial clock for SSP0. P1[21] -- General purpose digital input/output pin. USB_TX_DM1 -- D- transmit data for USB port 1 (OTG transceiver).[7] LCDVD[7]/LCDVD[11] -- LCD data.[7] PWM1[3] -- Pulse Width Modulator 1, channel 3 output. SSEL0 -- Slave Select for SSP0. P1[22] -- General purpose digital input/output pin. USB_RCV1 -- Differential receive data for USB port 1 (OTG transceiver).[7] LCDVD[8]/LCDVD[12] -- LCD data.[7] USB_PWRD1 -- Power Status for USB port 1 (host power switch). MAT1[0] -- Match output for Timer 1, channel 0. P1[23] -- General purpose digital input/output pin. USB_RX_DP1 -- D+ receive data for USB port 1 (OTG transceiver).[7] LCDVD[9]/LCDVD[13] -- LCD data.[7] PWM1[4] -- Pulse Width Modulator 1, channel 4 output. MISO0 -- Master In Slave Out for SSP0. P1[24] -- General purpose digital input/output pin. USB_RX_DM1 -- D- receive data for USB port 1 (OTG transceiver).[7] LCDVD[10]/LCDVD[14] -- LCD data.[7] PWM1[5] -- Pulse Width Modulator 1, channel 5 output. MOSI0 -- Master Out Slave in for SSP0.
P1[16]/ ENET_MDC P1[17]/ ENET_MDIO P1[18]/ USB_UP_LED1/ PWM1[1]/CAP1[0]
O I P1[19]/ USB_TX_E1/ USB_PPWR1/ CAP1[1] 68[1] U6[1] I/O O O I P1[20]/ USB_TX_DP1/ LCDVD[6]/ LCDVD[10]/ PWM1[2]/SCK0 70[1] U7[1] I/O O O O I/O P1[21]/ USB_TX_DM1/ LCDVD[7]/ LCDVD[11]/ PWM1[3]/SSEL0 72[1] R8[1] I/O O O O I/O P1[22]/USB_RCV1/ LCDVD[8]/ LCDVD[12]/ USB_PWRD1/ MAT1[0] 74[1] U8[1] I/O I O I O P1[23]/ USB_RX_DP1/ LCDVD[9]/ LCDVD[13]/ PWM1[4]/MISO0 76[1] P9[1] I/O I O O I/O P1[24]/ USB_RX_DM1/ LCDVD[10]/ LCDVD[14]/ PWM1[5]/MOSI0 78[1] T9[1] I/O I O O I/O
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
14 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 80[1] Ball T10[1] Type I/O O O O O 82[1] R10[1] I/O O O O I 88[1] T12[1] I/O I O I I 90[1] T13[1] I/O I/O O I O Description P1[25] -- General purpose digital input/output pin. USB_LS1 -- Low Speed status for USB port 1 (OTG transceiver).[7] LCDVD[11]/LCDVD[15] -- LCD data.[7] USB_HSTEN1 -- Host Enabled status for USB port 1. MAT1[1] -- Match output for Timer 1, channel 1. P1[26] -- General purpose digital input/output pin. USB_SSPND1 -- USB port 1 Bus Suspend status (OTG transceiver).[7] LCDVD[12]/LCDVD[20] -- LCD data.[7] PWM1[6] -- Pulse Width Modulator 1, channel 6 output. CAP0[0] -- Capture input for Timer 0, channel 0. P1[27] -- General purpose digital input/output pin. USB_INT1 -- USB port 1 OTG transceiver interrupt (OTG transceiver).[7] LCDVD[13]/LCDVD[21] -- LCD data.[7] USB_OVRCR1 -- USB port 1 Over-Current status. CAP0[1] -- Capture input for Timer 0, channel 1. P1[28] -- General purpose digital input/output pin. USB_SCL1 -- USB port 1 I2C serial clock (OTG transceiver).[7] LCDVD[14]/LCDVD[22] -- LCD data.[7] PCAP1[0] -- Capture input for PWM1, channel 0. MAT0[0] -- Match output for Timer 0, channel 0. P1[29] -- General purpose digital input/output pin. USB_SDA1 -- USB port 1 I2C serial data (OTG transceiver).[7] LCDVD[15]/LCDVD[23] -- LCD data.[7] PCAP1[1] -- Capture input for PWM1, channel 1. MAT0[1] -- Match output for Timer 0, channel 0. P1[30] -- General purpose digital input/output pin. USB_PWRD2 -- Power Status for USB port 2. VBUS -- Monitors the presence of USB bus power. Note: This signal must be HIGH for USB reset to occur. I AD0[4] -- A/D converter 0, input 4. P1[31] -- General purpose digital input/output pin. USB_OVRCR2 -- Over-Current status for USB port 2. SCK1 -- Serial Clock for SSP1. AD0[5] -- A/D converter 0, input 5. Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the pin connect block.
P1[25]/USB_LS1/ LCDVD[11]/ LCDVD[15]/ USB_HSTEN1/ MAT1[1]
P1[26]/ USB_SSPND1/ LCDVD[12]/ LCDVD[20]/ PWM1[6]/CAP0[0]
P1[27]/USB_INT1/ LCDVD[13]/ LCDVD[21]/ USB_OVRCR1/ CAP0[1]
P1[28]/USB_SCL1/ LCDVD[14]/ LCDVD[22]/ PCAP1[0]/MAT0[0]
P1[29]/USB_SDA1/ 92[1] LCDVD[15]/ LCDVD[23]/ PCAP1[1]/MAT0[1]
U14[1]
I/O I/O O I O
P1[30]/ USB_PWRD2/ VBUS/AD0[4]
42[3]
P2[3]
I/O I I
P1[31]/ USB_OVRCR2/ SCK1/AD0[5]
40[3]
P1[3]
I/O I I/O I I/O
P2[0] to P2[31]
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
15 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 154[1] Ball B17[1] Type I/O O O O O Description P2[0] -- General purpose digital input/output pin. PWM1[1] -- Pulse Width Modulator 1, channel 1 output. TXD1 -- Transmitter output for UART1. TRACECLK -- Trace clock.[8] LCDPWR -- LCD panel power enable.[8] P2[1] -- General purpose digital input/output pin. PWM1[2] -- Pulse Width Modulator 1, channel 2 output. RXD1 -- Receiver input for UART1. PIPESTAT0 -- Pipeline status, bit 0.[8] LCDLE -- Line end signal.[8] P2[2] -- General purpose digital input/output pin. PWM1[3] -- Pulse Width Modulator 1, channel 3 output. CTS1 -- Clear to Send input for UART1. PIPESTAT1 -- Pipeline status, bit 1.[8] LCDDCLK -- LCD panel clock.[8] P2[3] -- General purpose digital input/output pin. PWM1[4] -- Pulse Width Modulator 1, channel 4 output. DCD1 -- Data Carrier Detect input for UART1. PIPESTAT2 -- Pipeline status, bit 2.[8] LCDFP -- Frame pulse (STN). Vertical synchronization pulse (TFT).[8] P2[4] -- General purpose digital input/output pin. PWM1[5] -- Pulse Width Modulator 1, channel 5 output. DSR1 -- Data Set Ready input for UART1. TRACESYNC -- Trace Synchronization.[8] LCDENAB/LCDM -- STN AC bias drive or TFT data enable output.[8] P2[5] -- General purpose digital input/output pin. PWM1[6] -- Pulse Width Modulator 1, channel 6 output. DTR1 -- Data Terminal Ready output for UART1. TRACEPKT0 -- Trace Packet, bit 0.[8] LCDLP -- Line synchronization pulse (STN). Horizontal synchronization pulse (TFT).[8] P2[6] -- General purpose digital input/output pin. PCAP1[0] -- Capture input for PWM1, channel 0. RI1 -- Ring Indicator input for UART1. TRACEPKT1 -- Trace Packet, bit 1.[8] LCDVD[0]/LCDVD[4] -- LCD data.[8] P2[7] -- General purpose digital input/output pin. RD2 -- CAN2 receiver input. RTS1 -- Request to Send output for UART1. TRACEPKT2 -- Trace Packet, bit 2.[8] LCDVD[1]/LCDVD[5] -- LCD data.[8]
(c) NXP B.V. 2009. All rights reserved.
P2[0]/PWM1[1]/ TXD1/TRACECLK/ LCDPWR
P2[1]/PWM1[2]/ RXD1/PIPESTAT0/ LCDLE
152[1]
E14[1]
I/O O I O O
P2[2]/PWM1[3]/ CTS1/PIPESTAT1/ LCDDCLK
150[1]
D15[1]
I/O O I O O
P2[3]/PWM1[4]/ DCD1/PIPESTAT2/ LCDFP
144[1]
E16[1]
I/O O I O O
P2[4]/PWM1[5]/ DSR1/ TRACESYNC/ LCDENAB/LCDM
142[1]
D17[1]
I/O O I O O
P2[5]/PWM1[6]/ DTR1/ TRACEPKT0/ LCDLP
140[1]
F16[1]
I/O O O O O
P2[6]/PCAP1[0]/ RI1/ TRACEPKT1/ LCDVD[0]/ LCDVD[4]
138[1]
E17[1]
I/O I I O O
P2[7]/RD2/ RTS1/ TRACEPKT2/ LCDVD[1]/ LCDVD[5]
136[1]
G16[1]
I/O I O O O
LPC2470_2
Preliminary data sheet
Rev. 02 -- 15 October 2009
16 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 134[1] Ball H15[1] Type I/O O O O O Description P2[8] -- General purpose digital input/output pin. TD2 -- CAN2 transmitter output. TXD2 -- Transmitter output for UART2. TRACEPKT3 -- Trace packet, bit 3.[8] LCDVD[2]/LCDVD[6] -- LCD data.[8] P2[9] -- General purpose digital input/output pin. USB_CONNECT1 -- USB1 SoftConnect control. Signal used to switch an external 1.5 k resistor under the software control. Used with the SoftConnect USB feature. RXD2 -- Receiver input for UART2. EXTIN0 -- External Trigger Input.[8] LCDVD[3]/LCDVD[7] -- LCD data.[8] P2[10] -- General purpose digital input/output pin. Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take over control of the part after a reset. I EINT0 -- External interrupt 0 input. P2[11] -- General purpose digital input/output pin. EINT1 -- External interrupt 1 input.[10] LCDCLKIN -- LCD clock.[10] MCIDAT1 -- Data line 1 for SD/MMC interface. I2STX_CLK -- Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. P2[12] -- General purpose digital input/output pin. EINT2 -- External interrupt 2 input.[10] LCDVD[4]/LCDVD[3]/LCDVD[8]/LCDVD[18] -- LCD data.[10] MCIDAT2 -- Data line 2 for SD/MMC interface. I2STX_WS -- Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. P2[13] -- General purpose digital input/output pin. EINT3 -- External interrupt 3 input.[10] LCDVD[5]/LCDVD[9]/LCDVD[19] -- LCD data.[10] MCIDAT3 -- Data line 3 for SD/MMC interface. I2STX_SDA -- Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. P2[14] -- General purpose digital input/output pin. CS2 -- LOW active Chip Select 2 signal. CAP2[0] -- Capture input for Timer 2, channel 0. SDA1 -- I2C1 data input/output (this is not an open-drain pin). P2[15] -- General purpose digital input/output pin. CS3 -- LOW active Chip Select 3 signal. CAP2[1] -- Capture input for Timer 2, channel 1. SCL1 -- I2C1 clock input/output (this is not an open-drain pin).
(c) NXP B.V. 2009. All rights reserved.
P2[8]/TD2/TXD2/ TRACEPKT3/ LCDVD[2]/ LCDVD[6]
P2[9]/ USB_CONNECT1/ RXD2/EXTIN0/ LCDVD[3]/ LCDVD[7]
132[1]
H16[1]
I/O O
I I I
P2[10]/EINT0
110[9]
N15[9]
I/O
P2[11]/EINT1/ LCDCLKIN/ MCIDAT1/ I2STX_CLK
108[9]
T17[9]
I/O I O I/O I/O
P2[12]/EINT2/ LCDVD[4]/ LCDVD[3]/ LCDVD[8]/ LCDVD[18]/ MCIDAT2/ I2STX_WS
106[9]
N14[9]
I/O I O I/O I/O
P2[13]/EINT3/ LCDVD[5]/ LCDVD[9]/ LCDVD[19]/ MCIDAT3/ I2STX_SDA
102[9]
T16[9]
I/O I O I/O I/O
P2[14]/CS2/ CAP2[0]/SDA1
91[9]
R12[9]
I/O O I I/O
P2[15]/CS3/ CAP2[1]/SCL1
99[9]
P13[9]
I/O O I I/O
LPC2470_2
Preliminary data sheet
Rev. 02 -- 15 October 2009
17 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 87[1] 95[1] 59[1] 67[1] 73[1] 81[1] 85[1] Ball R11[1] R13[1] U3[1] R7[1] T8[1] U11[1] U12[1] Type I/O O I/O O I/O O I/O O I/O O I/O O I/O O I I/O Description P2[16] -- General purpose digital input/output pin. CAS -- LOW active SDRAM Column Address Strobe. P2[17] -- General purpose digital input/output pin. RAS -- LOW active SDRAM Row Address Strobe. P2[18] -- General purpose digital input/output pin. CLKOUT0 -- SDRAM clock 0. P2[19] -- General purpose digital input/output pin. CLKOUT1 -- SDRAM clock 1. P2[20] -- General purpose digital input/output pin. DYCS0 -- SDRAM chip select 0. P2[21] -- General purpose digital input/output pin. DYCS1 -- SDRAM chip select 1. P2[22] -- General purpose digital input/output pin. DYCS2 -- SDRAM chip select 2. CAP3[0] -- Capture input for Timer 3, channel 0. SCK0 -- Serial clock for SSP0. P2[23] -- General purpose digital input/output pin. DYCS3 -- SDRAM chip select 3. CAP3[1] -- Capture input for Timer 3, channel 1. SSEL0 -- Slave Select for SSP0. P2[24] -- General purpose digital input/output pin. CKEOUT0 -- SDRAM clock enable 0. P2[25] -- General purpose digital input/output pin. CKEOUT1 -- SDRAM clock enable 1. P2[26] -- General purpose digital input/output pin. CKEOUT2 -- SDRAM clock enable 2. MAT3[0] -- Match output for Timer 3, channel 0. MISO0 -- Master In Slave Out for SSP0. P2[27] -- General purpose digital input/output pin. CKEOUT3 -- SDRAM clock enable 3. MAT3[1] -- Match output for Timer 3, channel 1. MOSI0 -- Master Out Slave In for SSP0. P2[28] -- General purpose digital input/output pin. DQMOUT0 -- Data mask 0 used with SDRAM and static devices. P2[29] -- General purpose digital input/output pin. DQMOUT1 -- Data mask 1 used with SDRAM and static devices. P2[30] -- General purpose digital input/output pin. DQMOUT2 -- Data mask 2 used with SDRAM and static devices. MAT3[2] -- Match output for Timer 3, channel 2. SDA2 -- I2C2 data input/output (this is not an open-drain pin).
P2[16]/CAS P2[17]/RAS P2[18]/ CLKOUT0 P2[19]/ CLKOUT1 P2[20]/DYCS0 P2[21]/DYCS1 P2[22]/DYCS2/ CAP3[0]/SCK0
P2[23]/DYCS3/ CAP3[1]/SSEL0
64[1]
U5[1]
I/O O I I/O
P2[24]/ CKEOUT0 P2[25]/ CKEOUT1 P2[26]/ CKEOUT2/ MAT3[0]/MISO0
53[1] 54[1] 57[1]
P5[1] R4[1] T4[1]
I/O O I/O O I/O O O I/O
P2[27]/ CKEOUT3/ MAT3[1]/MOSI0
47[1]
P3[1]
I/O O O I/O
P2[28]/ DQMOUT0 P2[29]/ DQMOUT1 P2[30]/ DQMOUT2/ MAT3[2]/SDA2
49[1] 43[1] 31[1]
P4[1] N3[1] L4[1]
I/O O I/O O I/O O O I/O
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
18 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 39[1] Ball N2[1] Type I/O O O I/O I/O Description P2[31] -- General purpose digital input/output pin. DQMOUT3 -- Data mask 3 used with SDRAM and static devices. MAT3[3] -- Match output for Timer 3, channel 3. SCL2 -- I2C2 clock input/output (this is not an open-drain pin). Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the pin connect block. P3[0] -- General purpose digital input/output pin. D0 -- External memory data line 0. P3[1] -- General purpose digital input/output pin. D1 -- External memory data line 1. P3[2] -- General purpose digital input/output pin. D2 -- External memory data line 2. P3[3] -- General purpose digital input/output pin. D3 -- External memory data line 3. P3[4] -- General purpose digital input/output pin. D4 -- External memory data line 4. P3[5] -- General purpose digital input/output pin. D5 -- External memory data line 5. P3[6] -- General purpose digital input/output pin. D6 -- External memory data line 6. P3[7] -- General purpose digital input/output pin. D7 -- External memory data line 7. P3[8] -- General purpose digital input/output pin. D8 -- External memory data line 8. P3[9] -- General purpose digital input/output pin. D9 -- External memory data line 9. P3[10] -- General purpose digital input/output pin. D10 -- External memory data line 10. P3[11] -- General purpose digital input/output pin. D11 -- External memory data line 11. P3[12] -- General purpose digital input/output pin. D12 -- External memory data line 12. P3[13] -- General purpose digital input/output pin. D13 -- External memory data line 13. P3[14] -- General purpose digital input/output pin. D14 -- External memory data line 14. On POR, this pin serves as the BOOT0 pin.
P2[31]/ DQMOUT3/ MAT3[3]/SCL2
P3[0] to P3[31]
P3[0]/D0 P3[1]/D1 P3[2]/D2 P3[3]/D3 P3[4]/D4 P3[5]/D5 P3[6]/D6 P3[7]/D7 P3[8]/D8 P3[9]/D9 P3[10]/D10 P3[11]/D11 P3[12]/D12 P3[13]/D13 P3[14]/D14
197[1] 201[1] 207[1] 3[1] 13[1] 17[1] 23[1] 27[1] 191[1] 199[1] 205[1] 208[1] 1[1] 7[1] 21[1]
B4[1] B3[1] B1[1] E4[1] F2[1] G1[1] J1[1] L1[1] D8[1] C5[1] B2[1] D5[1] D4[1] C1[1] H2[1]
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
19 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol P3[15]/D15
Pin description ...continued Pin 28[1] Ball M1[1] Type I/O I/O Description P3[15] -- General purpose digital input/output pin. D15 -- External memory data line 15. On POR, this pin serves as the BOOT1 pin. BOOT[1:0] = 00 selects 8-bit external memory on CS1. BOOT[1:0] = 01 is reserved. Do not use. BOOT[1:0] = 10 selects 32-bit external memory on CS1. BOOT[1:0] = 11 selects 16-bit external memory on CS1.
P3[16]/D16/ PWM0[1]/TXD1
137[1]
F17[1]
I/O I/O O O
P3[16] -- General purpose digital input/output pin. D16 -- External memory data line 16. PWM0[1] -- Pulse Width Modulator 0, output 1. TXD1 -- Transmitter output for UART1. P3[17] -- General purpose digital input/output pin. D17 -- External memory data line 17. PWM0[2] -- Pulse Width Modulator 0, output 2. RXD1 -- Receiver input for UART1. P3[18] -- General purpose digital input/output pin. D18 -- External memory data line 18. PWM0[3] -- Pulse Width Modulator 0, output 3. CTS1 -- Clear to Send input for UART1. P3[19] -- General purpose digital input/output pin. D19 -- External memory data line 19. PWM0[4] -- Pulse Width Modulator 0, output 4. DCD1 -- Data Carrier Detect input for UART1. P3[20] -- General purpose digital input/output pin. D20 -- External memory data line 20. PWM0[5] -- Pulse Width Modulator 0, output 5. DSR1 -- Data Set Ready input for UART1. P3[21] -- General purpose digital input/output pin. D21 -- External memory data line 21. PWM0[6] -- Pulse Width Modulator 0, output 6. DTR1 -- Data Terminal Ready output for UART1. P3[22] -- General purpose digital input/output pin. D22 -- External memory data line 22. PCAP0[0] -- Capture input for PWM0, channel 0. RI1 -- Ring Indicator input for UART1. P3[23] -- General purpose digital input/output pin. D23 -- External memory data line 23. CAP0[0] -- Capture input for Timer 0, channel 0. PCAP1[0] -- Capture input for PWM1, channel 0.
P3[17]/D17/ PWM0[2]/RXD1
143[1]
F15[1]
I/O I/O O I
P3[18]/D18/ PWM0[3]/CTS1
151[1]
C15[1]
I/O I/O O I
P3[19]/D19/ PWM0[4]/DCD1
161[1]
B14[1]
I/O I/O O I
P3[20]/D20/ PWM0[5]/DSR1
167[1]
A13[1]
I/O I/O O I
P3[21]/D21/ PWM0[6]/DTR1
175[1]
C10[1]
I/O I/O O O
P3[22]/D22/ PCAP0[0]/RI1
195[1]
C6[1]
I/O I/O I I
P3[23]/D23/ CAP0[0]/ PCAP1[0]
65[1]
T6[1]
I/O I/O I I
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
20 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 58[1] Ball R5[1] Type I/O I/O I O 56[1] U2[1] I/O I/O O O 55[1] T3[1] I/O I/O O O 203[1] A1[1] I/O I/O I O 5[1] D2[1] I/O I/O I O 11[1] F3[1] I/O I/O O O 19[1] H3[1] I/O I/O O O 25[1] J3[1] I/O I/O O I/O Description P3[24] -- General purpose digital input/output pin. D24 -- External memory data line 24. CAP0[1] -- Capture input for Timer 0, channel 1. PWM1[1] -- Pulse Width Modulator 1, output 1. P3[25] -- General purpose digital input/output pin. D25 -- External memory data line 25. MAT0[0] -- Match output for Timer 0, channel 0. PWM1[2] -- Pulse Width Modulator 1, output 2. P3[26] -- General purpose digital input/output pin. D26 -- External memory data line 26. MAT0[1] -- Match output for Timer 0, channel 1. PWM1[3] -- Pulse Width Modulator 1, output 3. P3[27] -- General purpose digital input/output pin. D27 -- External memory data line 27. CAP1[0] -- Capture input for Timer 1, channel 0. PWM1[4] -- Pulse Width Modulator 1, output 4. P3[28] -- General purpose digital input/output pin. D28 -- External memory data line 28. CAP1[1] -- Capture input for Timer 1, channel 1. PWM1[5] -- Pulse Width Modulator 1, output 5. P3[29] -- General purpose digital input/output pin. D29 -- External memory data line 29. MAT1[0] -- Match output for Timer 1, channel 0. PWM1[6] -- Pulse Width Modulator 1, output 6. P3[30] -- General purpose digital input/output pin. D30 -- External memory data line 30. MAT1[1] -- Match output for Timer 1, channel 1. RTS1 -- Request to Send output for UART1. P3[31] -- General purpose digital input/output pin. D31 -- External memory data line 31. MAT1[2] -- Match output for Timer 1, channel 2. Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the pin connect block. P4[0] -- ]General purpose digital input/output pin. A0 -- External memory address line 0. P4[1] -- General purpose digital input/output pin. A1 -- External memory address line 1. P4[2] -- General purpose digital input/output pin. A2 -- External memory address line 2.
P3[24]/D24/ CAP0[1]/ PWM1[1]
P3[25]/D25/ MAT0[0]/ PWM1[2]
P3[26]/D26/ MAT0[1]/ PWM1[3]
P3[27]/D27/ CAP1[0]/ PWM1[4]
P3[28]/D28/ CAP1[1]/ PWM1[5]
P3[29]/D29/ MAT1[0]/ PWM1[6]
P3[30]/D30/ MAT1[1]/ RTS1
P3[31]/D31/ MAT1[2]
P4[0] to P4[31]
P4[0]/A0 P4[1]/A1 P4[2]/A2
75[1] 79[1] 83[1]
U9[1] U10[1] T11[1]
I/O I/O I/O I/O I/O I/O
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
21 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol P4[3]/A3 P4[4]/A4 P4[5]/A5 P4[6]/A6 P4[7]/A7 P4[8]/A8 P4[9]/A9 P4[10]/A10 P4[11]/A11 P4[12]/A12 P4[13]/A13 P4[14]/A14 P4[15]/A15 P4[16]/A16 P4[17]/A17 P4[18]/A18 P4[19]/A19
Pin description ...continued Pin 97[1] 103[1] 107[1] 113[1] 121[1] 127[1] 131[1] 135[1] 145[1] 149[1] 155[1] 159[1] 173[1] 101[1] 104[1] 105[1] 111[1] 109[1] Ball U16[1] R15[1] R16[1] M14[1] L16[1] J17[1] H17[1] G17[1] F14[1] C16[1] B16[1] B15[1] A11[1] U17[1] P14[1] P15[1] P16[1] R17[1] Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Description P4[3] -- General purpose digital input/output pin. A3 -- External memory address line 3. P4[4] -- General purpose digital input/output pin. A4 -- External memory address line 4. P4[5] -- General purpose digital input/output pin. A5 -- External memory address line 5. P4[6] -- General purpose digital input/output pin. A6 -- External memory address line 6. P4[7] -- General purpose digital input/output pin. A7 -- External memory address line 7. P4[8] -- General purpose digital input/output pin. A8 -- External memory address line 8. P4[9] -- General purpose digital input/output pin. A9 -- External memory address line 9. P4[10] -- General purpose digital input/output pin. A10 -- External memory address line 10. P4[11] -- General purpose digital input/output pin. A11 -- External memory address line 11. P4[12] -- General purpose digital input/output pin. A12 -- External memory address line 12. P4[13] -- General purpose digital input/output pin. A13 -- External memory address line 13. P4[14] -- General purpose digital input/output pin. A14 -- External memory address line 14. P4[15] -- General purpose digital input/output pin. A15 -- External memory address line 15. P4[16] -- General purpose digital input/output pin. A16 -- External memory address line 16. P4[17] -- General purpose digital input/output pin. A17 -- External memory address line 17. P4[18] -- General purpose digital input/output pin. A18 -- External memory address line 18. P4[19] -- General purpose digital input/output pin. A19 -- External memory address line 19. P4[20] -- General purpose digital input/output pin. A20 -- External memory address line 20. SDA2 -- I2C2 data input/output (this is not an open-drain pin). SCK1 -- Serial Clock for SSP1.
P4[20]/A20/ SDA2/SCK1
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
22 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol
Pin description ...continued Pin 115[1] Ball M15[1] Type I/O I/O I/O I/O Description P4[21] -- General purpose digital input/output pin. A21 -- External memory address line 21. SCL2 -- I2C2 clock input/output (this is not an open-drain pin). SSEL1 -- Slave Select for SSP1. P4[22] -- General purpose digital input/output pin. A22 -- External memory address line 22. TXD2 -- Transmitter output for UART2. MISO1 -- Master In Slave Out for SSP1. P4[23] -- General purpose digital input/output pin. A23 -- External memory address line 23. RXD2 -- Receiver input for UART2. MOSI1 -- Master Out Slave In for SSP1. P4[24] -- General purpose digital input/output pin. OE -- LOW active Output Enable signal. P4[25] -- General purpose digital input/output pin. WE -- LOW active Write Enable signal. P4[26] -- General purpose digital input/output pin. BLS0 -- LOW active Byte Lane select signal 0. P4[27] -- General purpose digital input/output pin. BLS1 -- LOW active Byte Lane select signal 1. P4 [28] -- General purpose digital input/output pin. BLS2 -- LOW active Byte Lane select signal 2. MAT2[0] -- Match output for Timer 2, channel 0.[11] LCDVD[6]/LCDVD[10]/LCDVD[2] -- LCD data.[11] TXD3 -- Transmitter output for UART3. P4[29] -- General purpose digital input/output pin. BLS3 -- LOW active Byte Lane select signal 3. MAT2[1] -- Match output for Timer 2, channel 1.[11] LCDVD[7]/LCDVD[11]/LCDVD[3] -- LCD data.[11] RXD3 -- Receiver input for UART3. P4[30] -- General purpose digital input/output pin. CS0 -- LOW active Chip Select 0 signal. P4[31] -- General purpose digital input/output pin. CS1 -- LOW active Chip Select 1 signal. ALARM -- RTC controlled output. This is a 1.8 V pin. It goes HIGH when a RTC alarm is generated. USB_D-2 -- USB port 2 bidirectional D- line. DBGEN -- JTAG interface control signal. Also used for boundary scanning. TDO -- Test Data Out for JTAG interface. TDI -- Test Data In for JTAG interface.
(c) NXP B.V. 2009. All rights reserved.
P4[21]/A21/ SCL2/SSEL1
P4[22]/A22/ TXD2/MISO1
123[1]
K14[1]
I/O I/O O I/O
P4[23]/A23/ RXD2/MOSI1
129[1]
J15[1]
I/O I/O I I/O
P4[24]/OE P4[25]/WE P4[26]/BLS0 P4[27]/BLS1
183[1] 179[1] 119[1] 139[1]
B8[1] B9[1] L15[1] G15[1] C11[1]
I/O O I/O O I/O O I/O O I/O O O O O
170[1] P4[28]/BLS2/ MAT2[0]/LCDVD[6]/ LCDVD[10]/ LCDVD[2]/ TXD3 176[1]
P4[29]/BLS3/ MAT2[1] LCDVD[7]/ LCDVD[11]/ LCDVD[3]/RXD3
B10[1]
I/O O O O I
P4[30]/CS0 P4[31]/CS1 ALARM USB_D-2 DBGEN TDO TDI
LPC2470_2
187[1] 193[1] 37[13] 52 9[1] 2[1] 4[1]
B7[1] A4[1] N1[13] U1 F4[1] D3[1] C2[1]
I/O O I/O O O I/O I O I
Preliminary data sheet
Rev. 02 -- 15 October 2009
23 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol TMS TRST TCK RTCK
Pin description ...continued Pin 6[1] 8[1] 10[1] 206[1] Ball E3[1] D1[1] E2[1] C3[1] Type I I I I/O Description TMS -- Test Mode Select for JTAG interface. TRST -- Test Reset for JTAG interface. TCK -- Test Clock for JTAG interface. This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to operate. RTCK -- JTAG interface control signal. Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0]) to operate as Trace port after reset.
RSTOUT RESET
29 35[12]
K3 M2[12]
O I
RSTOUT -- This is a 3.3 V pin. LOW on this pin indicates LPC2470 being in Reset state. external reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Input to the RTC oscillator circuit. Output from the RTC oscillator circuit. ground: 0 V reference for the digital IO pins.
XTAL1 XTAL2 RTCX1 RTCX2 VSSIO
44[13] 46[13] 34[13] 36[13] 33, 63, 77, 93, 114, 133, 148, 169, 189, 200[13] 32, 84, 172[13] 22[13]
M4[13] N4[13] K2[13] L2[13]
I O I O
L3, T5, I R9, P12, N16, H14, E15, A12, B6, A2[13] K4, P10, I D12[13] J2[13] I
VSSCORE VSSA
ground: 0 V reference for the core. analog ground: 0 V reference. This should nominally be the same voltage as VSSIO/VSSCORE, but should be isolated to minimize noise and error. 3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(3V3)
15, 60, 71, 89, 112, 125, 146, 165, 181, 198[13]
G3, P6, I P8, U13, P17, K16, C17, B13, C9, D7[13]
n.c. VDD(DCDC)(3V3) VDDA
30, 117, J4, L14, I 141[13] G14[13] 26, 86, 174[13] 20[13] H4, P11, I D11[13] G4[13] I
not connected pins: These pins must be left unconnected (floating). 3.3 V DC-to-DC converter supply voltage: This is the power supply for the on-chip DC-to-DC converter. analog 3.3 V pad supply voltage: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC.
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
24 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 4. Symbol VREF
Pin description ...continued Pin 24[13] Ball K1[13] Type I Description ADC reference: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. The level on this pin is used as a reference for ADC and DAC. RTC power supply: 3.3 V on this pin supplies the power to the RTC peripheral.
VBAT
38[13]
M3[13]
I
[1] [2] [3] [4] [5]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. Either the I2S function or the LCD function is selectable, see Table 14, Table 15, and Table 16. 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input, digital section of the pad is disabled. 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). Either the USB OTG function or the LCD function is selectable, see Table 14, Table 15, and Table 16. Either the trace function or the LCD function is selectable, see Table 14, Table 15, and Table 16. 5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[6] [7] [8] [9]
[10] Either one of the external interrupts EINT1 to EINT3 or the LCD function is selectable, see Table 14, Table 15, and Table 16. [11] Either one of the timer outputs MAT2[1] and MAT2[0] or the LCD function is selectable, see Table 14, Table 15, and Table 16. [12] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. [13] Pad provides special analog functionality.
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
25 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
7. Functional description
7.1 Architectural overview
The LPC2470 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external memory, and the AMBA APB for connection to other on-chip peripheral functions. The microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte order. The LPC2470 implements two AHBs in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the VIC, GPDMA controller, and EMC. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into off-chip memory or unused space in memory residing on AHB1. In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the AHB address space. Lower speed peripheral functions are connected to the APB. The AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a 2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is allocated a 16 kB address space within the APB address space. The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed complex instruction set computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets:
* the standard 32-bit ARM set * a 16-bit Thumb set
LPC2470_2
(c) NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 -- 15 October 2009
26 of 83
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
The Thumb set's 16-bit instruction length allows it to approach higher density compared to standard ARM code while retaining most of the ARM's performance.
7.2 On-chip SRAM
The LPC2470 includes a SRAM memory of 64 kB reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits. A 16 kB SRAM block serving as a buffer for the Ethernet controller and a 16 kB SRAM associated with the second AHB can be used both for data and code storage, too. The 2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered and retains the content in the absence of the main power supply.
7.3 Memory map
The LPC2470 memory map incorporates several distinct regions as shown in Table 5 and Figure 4. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either boot ROM or SRAM (see Section 7.26.6).
Table 5. LPC2470 memory usage and details Address range details and description 0x3FFF C000 - 0x3FFF FFFF 0x4000 0000 - 0x4000 FFFF 0x7FE0 0000 - 0x7FE0 3FFF 0x7FD0 0000 - 0x7FD0 3FFF Fast GPIO registers RAM (64 kB) Ethernet RAM (16 kB) USB RAM (16 kB) Fast I/O
Address range General use 0x0000 0000 to 0x3FFF FFFF
0x4000 0000 to On-chip RAM 0x7FFF FFFF
0x8000 0000 to Off-Chip Memory Four static memory banks, 16 MB each 0xDFFF FFFF 0x8000 0000 - 0x80FF FFFF Static memory bank 0 0x8100 0000 - 0x81FF FFFF 0x8200 0000 - 0x82FF FFFF 0x8300 0000 - 0x83FF FFFF Static memory bank 1 Static memory bank 2 Static memory bank 3
Four dynamic memory banks, 256 MB each 0xA000 0000 - 0xAFFF FFFF 0xB000 0000 - 0xBFFF FFFF 0xC000 0000 - 0xCFFF FFFF 0xD000 0000 - 0xDFFF FFFF 0xE000 0000 to APB Peripherals 0xEFFF FFFF 0xF000 0000 to AHB peripherals 0xFFFF FFFF 36 peripheral blocks, 16 kB each Dynamic memory bank 0 Dynamic memory bank 1 Dynamic memory bank 2 Dynamic memory bank 3
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4.0 GB AHB PERIPHERALS 3.75 GB APB PERIPHERALS 3.5 GB
0xFFFF FFFF 0xF000 0000
0xE000 0000
EXTERNAL STATIC AND DYNAMIC MEMORY
2.0 GB BOOT ROM
0x8000 0000 0x7FFF FFFF
RESERVED ADDRESS SPACE
1.0 GB
ON-CHIP STATIC RAM SPECIAL REGISTERS
0x4000 0000 0x3FFF FFFF 0x3FFF 8000
RESERVED ADDRESS SPACE
0.0 GB
002aad316
0x0000 0000
Fig 4. LPC2470 memory map
7.4 Interrupt controller
The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be programmed as FIQ or vectored IRQ types. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ
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service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority. When more than one interrupt is assigned the same priority and occur simultaneously, the one connected to the lowest numbered VIC channel will be serviced first. The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping to the address supplied by that register.
7.4.1 Interrupt sources
Each peripheral device has one interrupt line connected to the VIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on port 0 and port 2 (total of 64 pins) regardless of the selected function, can be programmed to generate an interrupt on a rising edge, a falling edge, or both. Such interrupt request coming from port 0 and/or port 2 will be combined with the EINT3 interrupt requests.
7.5 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined.
7.6 External memory controller
The LPC2470 EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant peripheral.
7.6.1 Features
* Dynamic memory interface support including single data rate SDRAM. * Asynchronous static memory device support including RAM, ROM, and flash, with or
without asynchronous page mode.
* * * * *
LPC2470_2
Low transaction latency. Read and write buffers to reduce latency and to improve performance. 8/16/32 data and 24 address lines wide static memory support. 16 bit and 32 bit wide chip select SDRAM memory support. Static memory features include:
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Flashless 16-bit/32-bit microcontroller
- Asynchronous page mode read - Programmable Wait States - Bus turnaround delay - Output enable and write enable delays - Extended wait
* Four chip selects for synchronous memory and four chip selects for static memory
devices.
* Power-saving modes dynamically control CKE and CLKOUT to SDRAMs. * Dynamic memory self-refresh mode controlled by software. * Controller supports 2048, 4096, and 8192 row address synchronous memory parts.
That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per device.
* Separate reset domains allow the for auto-refresh through a chip reset if desired.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
7.7 General purpose DMA controller
The GPDMA is an AMBA AHB compliant peripheral allowing selected LPC2470 peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receive. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the AHB master.
7.7.1 Features
* Two DMA channels. Each channel can support a unidirectional transfer. * The GPDMA can transfer data between the 16 kB SRAM, external memory, and
peripherals such as the SD/MMC, two SSPs, and the I2S interface.
* Single DMA and burst DMA request signals. Each peripheral connected to the
GPDMA can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the GPDMA.
* Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers.
* Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
* Hardware DMA channel priority. Each DMA channel has a specific hardware priority.
DMA channel 0 has the highest priority and channel 1 has the lowest priority. If requests from two channels become active at the same time, the channel with the highest priority is serviced first.
* AHB slave DMA programming interface. The GPDMA is programmed by writing to the
DMA control registers over the AHB slave interface.
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* One AHB master for transferring data. This interface transfers data when a DMA
request goes active.
* 32-bit AHB master bus width. * Incrementing or non-incrementing addressing for source and destination. * Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the peripheral.
* Internal four-word FIFO per channel. * Supports 8-bit, 16-bit, and 32-bit wide transactions. * An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
* Interrupt masking. The DMA error and DMA terminal count interrupt requests can be
masked.
* Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.8 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC2470 use accelerated GPIO functions:
* GPIO registers are relocated to the ARM local bus so that the fastest possible I/O
timing can be achieved.
* Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
* All GPIO registers are byte and half-word addressable. * Entire port value can be written in one instruction.
Additionally, any pin on port 0 and port 2 (total of 64 pins) that is not configured as an analog input/output can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake the chip up from Power-down mode.
7.8.1 Features
* Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
* Direction control of individual bits. * All I/O default to inputs after reset. * Backward compatibility with other earlier devices is maintained with legacy port 0 and
port 1 registers appearing at the original addresses on the APB.
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LPC2470
Flashless 16-bit/32-bit microcontroller
7.9 LCD controller
The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024 x 768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the displayed data) while still supporting a large number of colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time needed to operate the display.
7.9.1 Features
* * * *
AHB bus master interface to access frame buffer. Setup and control via a separate AHB slave interface. Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces.
* Supports single and dual-panel color STN displays. * Supports Thin Film Transistor (TFT) color displays. * Programmable display resolution including, but not limited to: 320 x 200, 320 x 240,
640 x 200, 640 x 240, 640 x 480, 800 x 600, and 1024 x 768. Hardware cursor support for single-panel displays. 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support. 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. 16 bpp true-color non-palettized, for color STN and TFT. 24 bpp true-color non-palettized, for color TFT. Programmable timing for different display panels. 256 entry, 16-bit palette RAM, arranged as a 128 x 32-bit RAM. Frame, line, and pixel clock signals. AC bias signal for STN, data enable signal for TFT panels. Supports little and big-endian, and Windows CE data formats. LCD panel clock may be generated from the peripheral clock, or from a clock input pin.
* * * * * * * * * * * *
7.10 Ethernet
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU.
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LPC2470
Flashless 16-bit/32-bit microcontroller
The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2470 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access off-chip memory via the EMC, as well as the SRAM located on another AHB. However, using memory other than the Ethernet SRAM, especially off-chip memory, will slow Ethernet access to memory and increase the loading of its AHB. The Ethernet block interfaces between an off-chip Ethernet PHY using the Media Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus.
7.10.1 Features
* Ethernet standards support:
- Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. - Fully compliant with IEEE standard 802.3. - Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure. - Flexible transmit and receive frame options. - Virtual Local Area Network (VLAN) frame support.
* Memory management:
- Independent transmit and receive buffers memory mapped to shared SRAM. - DMA managers with scatter/gather DMA and arrays of frame descriptors. - Memory traffic optimized by buffering and pre-fetching.
* Enhanced Ethernet features:
- Receive filtering. - Multicast and broadcast frame support for both transmit and receive. - Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit. - Selectable automatic transmit frame padding. - Over-length frame support for both transmit and receive allows any length frames. - Promiscuous receive mode. - Automatic collision back-off and frame retransmission. - Includes power management by clock switching. - Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter.
* Physical interface:
- Attachment of external PHY chip through standard MII or RMII interface. - PHY register access is available via the MIIM interface.
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LPC2470
Flashless 16-bit/32-bit microcontroller
7.11 USB interface
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. The LPC2470 USB interface includes a device, host, and OTG controller. Details on typical USB interfacing solutions can be found in Section 11.2 "Suggested USB interface solutions" on page 70
7.11.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory, and a DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. When enabled, the DMA controller transfers data between the endpoint buffer and the USB RAM. 7.11.1.1 Features
* * * * *
Fully compliant with USB 2.0 specification (full speed). Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM. Supports Control, Bulk, Interrupt and Isochronous endpoints. Scalable realization of endpoints at run time. Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time.
* Supports SoftConnect and GoodLink features. * While USB is in the Suspend mode, LPC2470 can enter one of the reduced power
modes and wake up on USB activity.
* Supports DMA transfers with the DMA RAM of 16 kB on all non-control endpoints. * Allows dynamic switching between CPU-controlled and DMA modes. * Double buffer implementation for Bulk and Isochronous endpoints.
7.11.2 USB host controller
The host controller enables full- and low-speed data exchange with USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies with the OHCI specification. 7.11.2.1 Features
* OHCI compliant * Two downstream ports * Supports per-port power switching
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7.11.3 USB OTG controller
USB OTG is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG controller integrates the host controller, device controller, and a master-only I2C interface to implement OTG dual-role device functionality. The dedicated I2C interface controls an external OTG transceiver. 7.11.3.1 Features
* Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
* Hardware support for Host Negotiation Protocol (HNP). * Includes a programmable timer required for HNP and Session Request Protocol
(SRP).
* Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
7.12 CAN controller and acceptance filters
The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router between two of CAN buses in industrial or automotive applications. Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN Library block, but the 8-bit registers of those devices have been combined in 32-bit words to allow simultaneous access in the ARM environment. The main operational difference is that the recognition of received Identifiers, known in CAN terminology as Acceptance Filtering, has been removed from the CAN controllers and centralized in a global Acceptance Filter.
7.12.1 Features
* * * * *
Two CAN controllers and buses. Data rates to 1 Mbit/s on each bus. 32-bit register and RAM access. Compatible with CAN specification 2.0B, ISO 11898-1. Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN buses. Standard Identifiers.
* Acceptance Filter can provide FullCAN-style automatic reception for selected * FullCAN messages can generate interrupts.
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LPC2470
Flashless 16-bit/32-bit microcontroller
7.13 10-bit ADC
The LPC2470 contains one ADC. It is a single 10-bit successive approximation ADC with eight channels.
7.13.1 Features
* * * * * * * *
10-bit successive approximation ADC Input multiplexing among 8 pins Power-down mode Measurement range 0 V to Vi(VREF) 10-bit conversion time 2.44 s Burst conversion mode for single or multiple inputs Optional conversion on transition of input pin or Timer Match signal Individual result registers for each ADC channel to reduce interrupt overhead
7.14 10-bit DAC
The DAC allows the LPC2470 to generate a variable analog output. The maximum output value of the DAC is Vi(VREF).
7.14.1 Features
* * * * *
10-bit DAC Resistor string architecture Buffered output Power-down mode Selectable output drive
7.15 UARTs
The LPC2470 contains four UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.15.1 Features
* * * *
16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. mechanism that enables software flow control implementation.
* Fractional divider for baud rate control, auto baud capabilities and FIFO control * UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
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* UART3 includes an IrDA mode to support infrared communication. 7.16 SPI serial I/O controller
The LPC2470 contains one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave always sends 8 bits to 16 bits of data to the master.
7.16.1 Features
* * * * *
Compliant with SPI specification Synchronous, Serial, Full Duplex Communication Combined SPI master and slave Maximum data bit rate of one eighth of the input clock rate 8 bits to 16 bits per transfer
7.17 SSP serial I/O controller
The LPC2470 contains two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data.
7.17.1 Features
* Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire
buses
* * * * *
Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame Maximum SPI bus data bit rate of one half (Master mode) and one twelfth (Slave mode) of the input clock rate
* DMA transfers supported by GPDMA 7.18 SD/MMC card interface
The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD memory cards. The SD card interface conforms to the SD Multimedia Card Specification Version 2.11.
7.18.1 Features
* The MCI provides all functions specific to the SD/MMC memory card. These include
the clock generation unit, power management control, and command and data transfer.
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* Conforms to Multimedia Card Specification v2.11. * Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. * Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital memory card.
* DMA supported through the GPDMA controller. 7.19 I2C-bus serial I/O controller
The LPC2470 contains three I2C-bus controllers. The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus and can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2470 supports bit rates up to 400 kbit/s (Fast I2C-bus).
7.19.1 Features
* I2C0 is a standard I2C compliant bus interface with open-drain pins. * I2C1 and I2C2 use standard I/O pins and do not support powering off of individual
devices connected to the same bus lines.
* * * * *
Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. one serial bus.
* Serial clock synchronization allows devices with different bit rates to communicate via * Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
* The I2C-bus can be used for test and diagnostic purposes. 7.20 I2S-bus serial I/O controllers
The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC2470 provides a separate transmit and receive channel, each of which can operate as either a master or a slave.
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7.20.1 Features
* The interface has separate input/output channels each of which can operate in master
or slave mode.
* Capable of handling 8-bit, 16-bit, and 32-bit word sizes. * Mono and stereo audio data supported. * The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
* * * *
Configurable word select period in master mode (separately for I2S input and output). Two 8 word FIFO data buffers are provided, one for transmit and one for receive. Generates interrupt requests when buffer levels cross a programmable boundary. Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block.
* Controls include reset, stop and mute options separately for I2S input and I2S output. 7.21 General purpose 32-bit timers/external event counters
The LPC2470 includes four 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. The Timer/Counter also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt.
7.21.1 Features
* A 32-bit Timer/Counter with a programmable 32-bit prescaler. * Counter or Timer operation. * Up to four 32-bit capture channels per timer, that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate an interrupt.
* Four 32-bit match registers that allow:
- Continuous operation with optional interrupt generation on match. - Stop timer on match with optional interrupt generation. - Reset timer on match with optional interrupt generation.
* Up to four external outputs corresponding to match registers, with the following
capabilities: - Set LOW on match. - Set HIGH on match. - Toggle on match. - Do nothing on match.
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7.22 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2470. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. A dedicated match register controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, a dedicated match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge).
7.22.1 Features
* LPC2470 has two PWMs with the same operational features. These may be operated
in a synchronized fashion by setting them both up to run at the same rate, then enabling both simultaneously. PWM0 acts as the master and PWM1 as the slave for this use.
* Counter or Timer operation (may use the peripheral clock or one of the capture inputs
as the clock source).
* Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow: - Continuous operation with optional interrupt generation on match. - Stop timer on match with optional interrupt generation. - Reset timer on match with optional interrupt generation.
* Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses.
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* Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate.
* Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
* Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must `release' new match values before they can become effective.
* May be used as a standard timer if the PWM mode is not enabled. * A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 7.23 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to `feed' (or reload) the watchdog within a predetermined amount of time.
7.23.1 Features
* Internally resets chip if not periodically reloaded. * Debug mode. * Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
* * * *
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. Flag to indicate watchdog reset. Programmable 32-bit timer with internal prescaler. Selectable time period from (Tcy(WDCLK) x 256 x 4) to (Tcy(WDCLK) x 232 x 4) in multiples of Tcy(WDCLK) x 4. Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of potential timing choices of Watchdog operation under different power reduction conditions. It also provides the ability to run the WDT from an entirely internal source that is not dependent on an external crystal and its associated components and wiring, for increased reliability.
* The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the
7.24 RTC and battery RAM
The RTC is a set of counters for measuring time when system power is on, and optionally when it is off. It uses little power in Power-down and Deep power-down modes. On the LPC2470, the RTC can be clocked by a separate 32.768 kHz oscillator or by a programmable prescale divider based on the APB clock. Also, the RTC is powered by its own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V supply used by the rest of the device.
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The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that can be used by external hardware to restore chip power and resume operation.
7.24.1 Features
* Measures the passage of time to maintain a calendar and clock. * Ultra low power design to support battery powered systems. * Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day
of Year.
* Dedicated 32 kHz oscillator or programmable prescaler from APB clock. * Dedicated power supply pin can be connected to a battery or to the main 3.3 V. * An alarm output pin is included to assist in waking up when the chip has had power
removed to all functions except the RTC and Battery RAM.
* Periodic interrupts can be generated from increments of any field of the time registers,
and selected fractional second values. This enhancement enables the RTC to be used as a System Timer.
* 2 kB data SRAM powered by VBAT. * RTC and Battery RAM power supply is isolated from the rest of the chip. 7.25 Clocking and power control
7.25.1 Crystal oscillators
The LPC2470 includes three independent oscillators. These are the Main Oscillator, the Internal RC oscillator, and the RTC oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Any of the three clock sources can be chosen by software to drive the PLL and ultimately the CPU. Following reset, the LPC2470 will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. 7.25.1.1 Internal RC oscillator The IRC may be used as the clock source for the WDT, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is trimmed to 1 % accuracy. Upon power-up or any chip reset, the LPC2470 uses the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.25.1.2 Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator operates at frequencies of 1 MHz to 24 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of
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PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.25.2 for additional information. 7.25.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU.
7.25.2 PLL
The PLL accepts an input clock frequency in the range of 32 kHz to 24 MHz. The input frequency is multiplied up to a high frequency, then divided down to provide the actual clock used by the CPU and the USB block. The PLL input, in the range of 32 kHz to 24 MHz, may initially be divided down by a value `N', which may be in the range of 1 to 256. This input division provides a wide range of output frequencies from the same input frequency. Following the PLL input divider is the PLL multiplier. This can multiply the input divider output through the use of a Current Controlled Oscillator (CCO) by a value `M', in the range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to 550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a phase-frequency detector to compare the divided CCO output to the multiplier input. The error value is used to adjust the CCO frequency. The PLL is turned off and bypassed following a chip Reset and by entering Power-down mode. PLL is enabled by software only. The program must configure and activate the PLL, wait for the PLL to lock, then connect to the PLL as a clock source.
7.25.3 Wake-up timer
The LPC2470 begins operation at power-up and when awakened from Power-down and Deep-power down modes by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of Reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down and Deep power-down modes, any wake-up of the processor from Power-down modes makes use of the Wake-up Timer. The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient conditions.
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7.25.4 Power control
The LPC2470 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, Peripheral power control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. The LPC2470 also implements a separate power domain in order to allow turning off power to the bulk of the device while maintaining operation of the RTC and a small SRAM, referred to as the Battery RAM. 7.25.4.1 Idle mode In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 7.25.4.2 Sleep mode In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The 32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The CCLK and USB clock dividers automatically get reset to zero. The Sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Sleep mode reduces chip power consumption to a very low value. On the wake-up from Sleep mode, if the IRC was used before entering Sleep mode, the code execution and peripherals activities will resume after 4 cycles expire. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. The customers need to reconfigure the PLL and clock dividers accordingly. 7.25.4.3 Power-down mode Power-down mode does everything that Sleep mode does but also turns off the IRC oscillator. On the wake-up from Power-down mode, if the IRC was used before entering Power-down mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. The customers need to reconfigure the PLL and clock dividers accordingly after a wake-up from Power-down mode.
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7.25.4.4
Deep power-down mode Deep power-down mode is similar to the Power-down mode, but now the on-chip regulator that supplies power to the internal logic is also shut off. This produces the lowest possible power consumption without removing power from the entire chip. Since the Deep power-down mode shuts down the on-chip logic power supply, there is no register or memory retention, and resumption of operation involves the same activities as a full chip reset. If power is supplied to the LPC2470 during Deep power-down mode, wake-up can be caused by the RTC Alarm interrupt or by external Reset. While in Deep power-down mode, external device power may be removed. In this case, the LPC2470 will start up when external power is restored. Essential data may be retained through Deep power-down mode (or through complete powering off of the chip) by storing data in the Battery RAM, as long as the external power to the VBAT pin is maintained.
7.25.4.5
Power domains The LPC2470 provides two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the RTC and the Battery RAM. On the LPC2470, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the VDD(DCDC)(3V3) pins power the on-chip DC-to-DC converter which in turn provides power to the CPU and most of the peripherals. Although both the I/O pad ring and the core require a 3.3 V supply, different powering schemes can be used depending on the actual application requirements. The first option assumes that power consumption is not a concern and the design ties the VDD(3V3) and VDD(DCDC)(3V3) pins together. This approach requires only one 3.3 V power supply for both pads, the CPU, and peripherals. While this solution is simple, it does not support powering down the I/O pad ring "on the fly" while keeping the CPU and peripherals alive. The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and a dedicated 3.3 V supply for the CPU (VDD(DCDC)(3V3)). Having the on-chip DC-DC converter powered independently from the I/O pad ring enables shutting down of the I/O pad power supply "on the fly", while the CPU and peripherals stay active. The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that may be used by external hardware to restore chip power and resume operation.
7.26 System control
7.26.1 Reset
Reset has four sources on the LPC2470: the RESET pin, the Watchdog reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable
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level, starts the wake-up timer (see description in Section 7.25.3 "Wake-up timer"), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, and a fixed number of clocks have passed. Once the internal reset is removed, all of the processor and peripheral registers have been initialized to predetermined values and the LPC2470 continues with booting from an external static memory.
7.26.2 Boot process
The processor always boots from the off-chip static memory bank 1, executing code from address 0x8100 0000 (see Table 5 "LPC2470 memory usage and details"). During the boot process initiated by POR, the boot pins P3[15]/D15 and P3[14]/D14 are sampled, and the external memory banks 0 and 1 are configured with the same data bus width. The data bus width is determined by the setting of the two boot pins. Unused address pins are configured as GPIO. See Section 11.5 "Suggested boot memory interface solutions" for address and data bus interface details. Remark: After POR, the address ranges of chip select 1 and chip select 0 are swapped. The user code residing in the external boot memory must be linked to execute from address location 0x8000 0000. When booting from external memory, the interrupt vectors are mapped to the bottom of the external memory. Once booting is over, the application must map interrupt vectors to the proper domain.
7.26.3 Brownout detection
The LPC2470 includes 2-stage monitoring of the voltage on the VDD(DCDC)(3V3) pins. If this voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the VIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts a BOD Reset and generates a Reset (if this reset source is enabled in software) to inactivate the LPC2470 when the voltage on the VDD(DCDC)(3V3) pins falls below 2.65 V. The BOD circuit maintains this reset down below 1 V, at which point the power-on reset circuitry maintains the overall Reset. Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly-executed event loop to sense the condition.
7.26.4 AHB
The LPC2470 implements two AHB in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 16 kB SRAM. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into off-chip memory or unused space in memory residing on AHB1.
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In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block.
7.26.5 External interrupt inputs
The LPC2470 includes up to 68 edge sensitive interrupt inputs combined with up to four level sensitive external interrupt inputs as selectable pin functions. The external interrupt inputs can optionally be used to wake up the processor from Power-down mode.
7.26.6 Memory mapping control
The memory mapping control alters the mapping of the interrupt vectors that appear at the beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot ROM, the SRAM, or external memory. This allows code running in different memory spaces to have control of the interrupts. When booting from an external memory the interrupt vectors are mapped to the bottom of the external memory. Once booting is over the application must map interrupt vectors to the proper domain.
7.27 Emulation and debugging
The LPC2470 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on P2[0] to P2[9]. This means that all communication, timer, and interface peripherals residing on other pins are available during the development and debugging phase as they are when the application is run in the embedded system itself.
7.27.1 EmbeddedICE
The EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present on the target system. The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic. The JTAG clock (TCK) must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to operate.
7.27.2 Embedded trace
Since the LPC2470 have significant amounts of on-chip memories, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores. It outputs
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information about processor execution to a trace port. A software debugger allows configuration of the ETM using a JTAG interface and displays the trace information that has been captured. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external Trace Port Analyzer captures the trace information under software debugger control. The trace port can broadcast the Instruction trace information. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction.
7.27.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC, which is present in the EmbeddedICE logic. The LPC2470 contain a specific configuration of RealMonitor software programmed into the on-chip ROM memory.
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8. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(3V3) Parameter supply voltage (3.3 V) Conditions core and external rail Min 3.0 3.0 -0.5 for the RTC on ADC related pins 5 V tolerant I/O pins; only valid when the VDD(3V3) supply voltage is present other I/O pins IDD ISS Tstg Ptot(pack) supply current ground current storage temperature total power dissipation (per package) based on package heat transfer, not device power consumption human body model; all pins
[6] [2]
Max 3.6 3.6 +4.6 +4.6 +4.6 +5.1 +6.0
Unit V V V V V V V
VDD(DCDC)(3V3) DC-to-DC converter supply voltage (3.3 V) VDDA Vi(VBAT) Vi(VREF) VIA VI analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF analog input voltage input voltage
-0.5 -0.5 -0.5 -0.5
[2][3]
-0.5 -65 -
VDD(3V3) + 0.5 100 100 +150 1.5
V mA mA C W
per supply pin per ground pin
[4] [4] [5]
Vesd
electrostatic discharge voltage
-2500
+2500
V
[1]
The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSSIO/VSSCORE unless otherwise noted. Including voltage on outputs in 3-state mode. Not to exceed 4.6 V. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[2] [3] [4] [5] [6]
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9. Static characteristics
Table 7. Static characteristics Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol VDD(3V3) VDD(DCDC)(3V3) VDDA Vi(VBAT) Vi(VREF) Parameter supply voltage (3.3 V) DC-to-DC converter supply voltage (3.3 V) analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF LOW-level input current HIGH-level input current OFF-state output current I/O latch-up current VI = 0 V; no pull-up VI = VDD(3V3); no pull-down VO = 0 V; VO = VDD(3V3); no pull-up/down -(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 C VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current HIGH-level short-circuit output current IOH = -4 mA IOL = -4 mA VOH = VDD(3V3) - 0.4 V VOL = 0.4 V VOH = 0 V
[7] [2]
Conditions core and external rail
Min 3.0 3.0 3.0 2.0 2.5
Typ[1] 3.3 3.3 3.3 3.3 3.3
Max 3.6 3.6 3.6 3.6 VDDA
Unit V V V V V
Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch 3 3 3 100 A A A mA
pin configured to provide a digital function output active
[3][4][5] [6]
0 0 2.0 0.4 VDD(3V3) - 0.4 -4 4 -
-
5.5 VDD(3V3) 0.8 0.4 -45
V V V V V V V mA mA mA
[7]
[7]
[7]
[8]
IOLS Ipd Ipu
LOW-level short-circuit VOL = VDDA output current pull-down current pull-up current VI = 5 V VI = 0 V VDD(3V3) < VI < 5 V
[8]
10 -15 0
50 -50 0
50 150 -85 0
mA A A A
[9]
[9]
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Table 7. Static characteristics ...continued Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IDD(DCDC)act(3V3) active mode DC-to-DC VDD(DCDC)(3V3) = 3.3 V; converter supply Tamb = 25 C; code current (3.3 V) while(1){} executed from the on-chip SRAM; no peripherals enabled; PCLK = CCLK / 8 CCLK = 12 MHz CCLK = 72 MHz IDD(DCDC)pd(3V3) power-down mode DC-to-DC converter supply current (3.3 V) active mode battery supply current pins (P0[27] and P0[28]) HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 3 mA VI = VDD(3V3) VI = 5 V Oscillator pins Vi(XTAL1) Vo(XTAL2) Vi(RTCX1) Vo(RTCX2) input voltage on pin XTAL1 output voltage on pin XTAL2 input voltage on pin RTCX1 output voltage on pin RTCX2 -0.5 -0.5 -0.5 -0.5 +1.8 +1.8 +1.8 +1.8 +1.95 +1.95 +1.95 +1.95 V V V V
[7]
-
17.4 66.1
-
mA mA
VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C DC-to-DC converter on DC-to-DC converter off
[10] [10]
150 20 28
-
A A A V
IBATact I2C-bus VIH VIL Vhys VOL ILI
-
0.7VDD(3V3) -
0.3VDD(3V3) V V V A A
0.5VDD(3V3) 2 10 0.4 4 22
[11]
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Table 7. Static characteristics ...continued Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol USB pins IOZ VBUS VDI VCM Vth(rs)se OFF-state output current bus supply voltage differential input sensitivity voltage differential common mode voltage range single-ended receiver switching threshold voltage LOW-level output voltage for low-/full-speed HIGH-level output voltage (driven) for low-/full-speed transceiver capacitance driver output impedance for driver which is not high-speed capable pull-up resistance RL of 1.5 k to 3.6 V |(D+) - (D-)| includes VDI range 0 V < VI < 3.3 V 0.2 0.8 0.8 10 5.25 2.5 2.0 A V V V V Parameter Conditions Min Typ[1] Max Unit
VOL
-
-
0.18
V
VOH
RL of 15 k to GND
2.8
-
3.5
V
Ctrans ZDRV
pin to GND with 33 series resistor; steady state drive
[12]
36
-
20 44.1
pF
Rpu
[1] [2] [3] [4] [5] [6] [7] [8] [9]
SoftConnect = ON
1.1
-
1.9
k
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages The RTC typically fails when Vi(VBAT) drops below 1.6 V. Including voltage on outputs in 3-state mode. VDD(3V3) supply voltages must be present. 3-state outputs go into 3-state mode when VDD(3V3) is grounded. Please also see the errata note in errata sheet. Accounts for 100 mV voltage drop in all supply lines. Allowed as long as the current limit does not exceed the maximum current allowed by the device. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[10] On pin VBAT. [11] To VSSIO/VSSCORE. [12] Includes external resistors of 33 1 % on D+ and D-.
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9.1 Power consumption static characteristics
Table 8. Power consumption static characteristics Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol IBAT Parameter battery supply current Conditions
[2] [2]
Min -
Typ[1] 19
Max -
Unit A
Deep power-down mode IDD(DCDC)dpd(3V3) deep power-down mode DC-to-DC converter supply current (3.3 V) Power-down mode IBAT IDD(DCDC)pd(3V3) battery supply current power-down mode DC-to-DC converter supply current (3.3 V)
[2] [2]
-
19 18
-
A A
-
113
-
A
[1] [2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb = 25 C.
9.1.1 Deep power-down mode
002aae046
300 IDD(IO) (A) 200
100
VDD(3V3) = 3.3 V
VDD(3V3) = 3.0 V 0 -40 -15 10 35 60 85 temperature (C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.
Fig 5.
I/O maximum supply current IDDdpd(3V3) versus temperature in Deep power-down mode
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Flashless 16-bit/32-bit microcontroller
40 IBAT (A) 30 Vi(VBAT) = 3.3 V Vi(VBAT) = 3.0 V 20
002aae047
10
0 -40
-15
10
35
60 85 temperature (C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C
Fig 6.
RTC battery maximum supply current IBAT versus temperature in Deep power-down mode
100 IDD(DCDC)dpd(3v3) (A) 80
002aae048
60 VDD(DCDC)(3V3) = 3.3 V 40 VDD(DCDC)(3V3) = 3.0 V 20
0 -40
-15
10
35
60 85 temperature (C)
VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.
Fig 7.
Total DC-to-DC converter maximum supply current IDD(DCDC)dpd(3V3) versus temperature in Deep power-down mode
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
9.1.2 Power-down mode
002aae049
4 IDD(IO) (A) 2 VDD(3V3) = 3.3 V VDD(3V3) = 3.0 V 0
-2
-4 -40
-15
10
35
60 85 temperature (C)
Vi(VBAT) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.
Fig 8.
I/O maximum supply current IDD(IO) versus temperature in Power-down mode
40 IBAT (A) 30 Vi(VBAT) = 3.3 V Vi(VBAT) = 3.0 V 20
002aae050
10
0 -40
-15
10
35
60 85 temperature (C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.
Fig 9.
RTC battery maximum supply current IBATversus temperature in Power-down mode
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
800 IDD(DCDC)pd(3v3) (A) 600
002aae051
400
VDD(DCDC)(3V3) = 3.3 V 200 VDD(DCDC)(3V3) = 3.0 V
0 -40
-15
10
35
60 85 temperature (C)
VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.
Fig 10. Total DC-to-DC converter supply current IDD(DCDC)dpd(3V3) at different temperatures in Power-down mode
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Preliminary data sheet
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LPC2470
Flashless 16-bit/32-bit microcontroller
9.2 ADC static characteristics
Table 9. ADC static characteristics VDDA = 2.5 V to 3.6 V; Tamb = -40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO EG ET Rvsi Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error voltage source interface resistance
Conditions: VSSA = 0 V, VDDA = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 11. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 11. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 11. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 11. The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 11. See Figure 12.
[1][2][3] [1][4] [1][5] [1][6] [1][7] [8]
Conditions
Min 0 -
Typ -
Max VDDA 1 1 2 3 0.5 4 40
Unit V pF LSB LSB LSB % LSB k
[1] [2] [3] [4] [5] [6] [7] [8]
LPC2470_2
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
offset error EO 1023
gain error EG
1022
1021
1020
1019
1018
(2)
7 code out 6
(1)
5
(5)
4
(4)
3
(3)
2
1
1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024
0 1 offset error EO 2 3 4 5 6 7 VIA (LSBideal)
1 LSB =
VDDA - VSSA 1024
002aac046
(1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve.
Fig 11. ADC characteristics
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LPC2470
Flashless 16-bit/32-bit microcontroller
LPC2XXX
20 k
AD0[y]SAMPLE
3 pF 5 pF
AD0[y]
Rvsi
VEXT
VSSIO, VSSCORE
002aad586
Fig 12. Suggested ADC interface - LPC2470 AD0[y] pin
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Preliminary data sheet
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LPC2470
Flashless 16-bit/32-bit microcontroller
10. Dynamic characteristics
Table 10. Dynamic characteristics of USB pins (full-speed) CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3), unless otherwise specified. Symbol tr tf tFRFM VCRS tFEOPT tFDEOP tJR1 tJR2 tEOPR1 Parameter rise time fall time differential rise and fall time matching output signal crossover voltage source SE0 interval of EOP source jitter for differential transition to SE0 transition receiver jitter to next transition receiver jitter for paired transitions EOP width at receiver 10 % to 90 % must reject as EOP; see Figure 14 must accept as EOP; see Figure 14
[1]
Conditions 10 % to 90 % 10 % to 90 % tr / tf
Min 8.5 7.7 1.3
Typ -
Max 13.8 13.7 109 2.0 175 +5 +18.5 +9 -
Unit ns ns % V ns ns ns ns ns
see Figure 14 see Figure 14
160 -2 -18.5 -9 40
tEOPR2
EOP width at receiver
[1]
82
-
-
ns
[1]
Characterized but not implemented as production test. Guaranteed by design.
Table 11. Dynamic characteristics Tamb = -40 C to +85 C for commercial applications; VDD(3V3) over specified ranges.[1] Symbol External clock fosc Tcy(clk) tCHCX tCLCX tCLCH tCHCL I2C-bus tf(o) SSP interface tsu(SPI_MISO) SPI_MISO set-up time oscillator frequency clock cycle time clock HIGH time clock LOW time clock rise time clock fall time pins (P0[27] and P0[28]) output fall time VIH to VIL 20 + 0.1 x Cb[3] 11 ns ns 1 42 Tcy(clk) x 0.4 Tcy(clk) x 0.4 24 1000 5 5 MHz ns ns ns ns ns Parameter Conditions Min Typ[2] Max Unit
Tamb = 25 C; measured in SPI Master mode; see Figure 15
[1] [2] [3]
Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. Bus capacitance Cb in pF, from 10 pF to 400 pF.
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Preliminary data sheet
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Preliminary data sheet Rev. 02 -- 15 October 2009
(c) NXP B.V. 2009. All rights reserved. LPC2470_2
NXP Semiconductors
Table 12. Dynamic characteristics: Static external memory interface CL = 30 pF, Tamb = -40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, AHB clock = 1 MHz Symbol tCSLAV Parameter CS LOW to address valid time OE LOW to address valid time CS LOW to OE LOW time memory access time data input hold time CS HIGH to OE HIGH time OE HIGH to address invalid time OE LOW to OE HIGH time BLS LOW to address valid time CS HIGH to BLS HIGH time parameters[1][6] -0.88 + Tcy(CCLK) x (1 + WAITWEN) -0.88 0.68 0
[3] [3][4]
Conditions
Min -0.29
Typ 0.20
Max 2.54
Unit ns
Common to read and write cycles[1]
Read cycle parameters[1][2] tOELAV tCSLOEL tam th(D) tCSHOEH tOEHANV tOELOEH tBLSLAV tCSHBLSH tCSLWEL tCSLBLSL tWELDV tCSLDV tWELWEH -0.29 0.20 2.54 0.49 + Tcy(CCLK) x WAITOEN (WAITRD - WAITOEN + 1) x Tcy(CCLK) - 12.70 5.20 0.20 2.44 0.10 + (WAITRD - WAITOEN + 1) x Tcy(CCLK) 2.54 0.68 0.20 + Tcy(CCLK) x (1 + WAITWEN) 0.98 5.86 4.79 0.10 + Tcy(CCLK) x (WAITWR - WAITWEN + 1) 0.59 + Tcy(CCLK) x (WAITWR - WAITWEN + 3) 2.74 + Tcy(CCLK) ns ns ns ns ns ns ns ns ns
-0.78 + Tcy(CCLK) x WAITOEN 0 + Tcy(CCLK) x WAITOEN (WAITRD - WAITOEN + 1) x Tcy(CCLK) - 8.11 1.29 -0.49 -0.20 -0.59 + (WAITRD - WAITOEN + 1) x Tcy(CCLK) -0.39 -0.88 (WAITRD - WAITOEN + 1) x Tcy(CCLK) - 9.57 4.22 0 0.20 0 + (WAITRD - WAITOEN + 1) x Tcy(CCLK) 0 0.49 0.10 + Tcy(CCLK) x (1 + WAITWEN) 0.49 2.54 2.64 0 + Tcy(CCLK) x (WAITWR - WAITWEN + 1) 0 + Tcy(CCLK) x (WAITWR - WAITWEN + 3) 0.20 + Tcy(CCLK)
[5]
Write cycle
CS LOW to WE LOW time CS LOW to BLS LOW time WE LOW to data valid time CS LOW to data valid time WE LOW to WE HIGH time
Flashless 16-bit/32-bit microcontroller
ns ns ns ns ns ns
-0.78 + Tcy(CCLK) x (WAITWR - WAITWEN + 1) -0.88 + Tcy(CCLK) x (WAITWR - WAITWEN + 3) 0 + Tcy(CCLK)
tBLSLBLSH BLS LOW to BLS HIGH time tWEHANV WE HIGH to address invalid time
[3]
LPC2470
[3]
61 of 83
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Table 12. Dynamic characteristics: Static external memory interface ...continued CL = 30 pF, Tamb = -40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, AHB clock = 1 MHz Symbol tWEHDNV tBLSHANV tBLSHDNV Parameter WE HIGH to data invalid time BLS HIGH to address invalid time BLS HIGH to data invalid time Conditions
[3]
Preliminary data sheet Rev. 02 -- 15 October 2009 62 of 83
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NXP Semiconductors
Min 0.78 -0.29 0
Typ 2.54 0.20 2.54
Max 5.96 2.54 5.37
Unit ns ns ns
[3]
[3]
[1] [2] [3] [4] [5] [6]
VOH = 2.5 V, VOL = 0.2 V. VIH = 2.5 V, VIL = 0.5 V. Tcy(CCLK) = 1CCLK. Latest of address valid, CS LOW, OE LOW to data valid. Earliest of CS HIGH, OE HIGH, address change to data invalid. Byte lane state bit (PB) = 1.
Flashless 16-bit/32-bit microcontroller
LPC2470
NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 13. Dynamic characteristics: Dynamic external memory interface CL = 30 pF, Tamb = -40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, AHB clock = 1 MHz Symbol Common td(SV) th(S) td(RASV) th(RAS) td(CASV) th(CAS) td(WV) th(W) td(GV) th(G) td(AV) th(A) tsu(D) th(D) td(QV) th(Q) chip select valid delay time chip select hold time row address strobe valid delay time row address strobe hold time column address strobe valid delay time column address strobe hold time write valid delay time write hold time output enable valid delay time output enable hold time address valid delay time address hold time data input set-up time data input hold time data output valid delay time data output hold time 0.1 0.5 0.1 0.1 0.1 0.1 0.51 0.57 0.49 1.05 1.02 1.51 1.51 0.98 0.97 0.84 0.84 0.95 1 0.87 0.81 2.24 2.41 2.65 2.61 1.76 1.95 1.27 1.95 1.86 1.95 4.36 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Parameter Conditions Min Typ Max Unit
Read cycle parameters
Write cycle parameters
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Flashless 16-bit/32-bit microcontroller
10.1 Timing
tCHCL
tCLCX Tcy(clk)
tCHCX tCLCH
002aaa907
Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
TPERIOD crossover point differential data lines
crossover point extended
source EOP width: tFEOPT differential data to SE0/EOP skew n x TPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 14. Differential data-to-EOP transition skew and EOP width
shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
Fig 15. MISO line set-up time in SSP Master mode
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tCSLAV CS
tCSHOEH
addr tam data tCSLOEL tOELAV tOELOEH OE tOEHANV th(D)
tBLSLAV BLS
tCSHBLSH
002aad955
Fig 16. External memory read access
CS
tAVCSL tWELWEH tBLSLBLSH tWEHANV tCSLBLSL tWELDV tBLSHANV
tCSLWEL BLS/WE
addr tCSLDV data tWEHDNV tBLSHDNV
OE
002aad956
Fig 17. External memory write access
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Flashless 16-bit/32-bit microcontroller
reference clock
td(XXX)
th(XXX)
output signal (O)
tsu(D)
th(D)
input signal (I)
002aad636
Fig 18. Signal timing
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
11. Application information
11.1 LCD panel signal usage
Table 14. LCD panel connections for STN single panel mode 4-bit mono STN single panel LPC2470 pin used LCDVD[23] LCDVD[22] LCDVD[21] LCDVD[20] LCDVD[19] LCDVD[18] LCDVD[17] LCDVD[16] LCDVD[15] LCDVD[14] LCDVD[13] LCDVD[12] LCDVD[11] LCDVD[10] LCDVD[9] LCDVD[8] LCDVD[7] LCDVD[6] LCDVD[5] LCDVD[4] LCDVD[3] LCDVD[2] LCDVD[1] LCDVD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN
[1] [2] [3]
External pin
8-bit mono STN single panel LPC2470 pin used P4[29][3] P4[28][3] P2[13][2] P2[12][2] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[11][2] LCD function UD[7] UD[6] UD[5] UD[4] UD[3] UD[2] UD[1] UD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN
Color STN single panel LPC2470 pin used P4[29][3] P4[28][3] P2[13][2] P2[12][2] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[0][2] LCD function UD[7] UD[6] UD[5] UD[4] UD[3] UD[2] UD[1] UD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDPWR
LCD function UD[3] UD[2] UD[1] UD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE CDPWR LCDCLKIN
P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[11][2]
ETM replaced with LCD pins. External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins. Timer pins MAT2[0] and MAT2[1] replaced with LCD pins.
LPC2470_2
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 15.
LCD panel connections for STN dual panel mode 4-bit mono STN dual panel LPC2470 pin used LCD function P4[29][3] P4[28][3] P2[13][2] P2[12][2] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[11][2] LD[3] LD[2] LD[1] LD[0] UD[3] UD[2] UD[1] UD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN 8-bit mono STN dual panel LPC2470 pin used P1[29][4] P1[28][4] P1[27][4] P1[26][4] P1[25][4] P1[24][4] P1[23][4] P1[22][4] P1[21][4] P1[20][4] P2[13][2] P2[12][2] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[11][2] LCD function LD[7] LD[6] LD[5] LD[4] LD[3] LD[2] LD[1] LD[0] UD[7] UD[6] UD[5] UD[4] UD[3] UD[2] UD[1] UD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN Color STN dual panel LPC2470 pin used P1[29][4] P1[28][4] P1[27][4] P1[26][4] P1[25][4] P1[24][4] P1[23][4] P1[22][4] P1[21][4] P1[20][4] P2[13][2] P2[12][2] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[11][2] LCD function LD[7] LD[6] LD[5] LD[4] LD[3] LD[2] LD[1] LD[0] UD[7] UD[6] UD[5] UD[4] UD[3] UD[2] UD[1] UD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN
External pin
LCDVD[23] LCDVD[22] LCDVD[21] LCDVD[20] LCDVD[19] LCDVD[18] LCDVD[17] LCDVD[16] LCDVD[15] LCDVD[14] LCDVD[13] LCDVD[12] LCDVD[11] LCDVD[10] LCDVD[9] LCDVD[8] LCDVD[7] LCDVD[6] LCDVD[5] LCDVD[4] LCDVD[3] LCDVD[2] LCDVD[1] LCDVD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN
[1] [2] [3] [4]
-
ETM replaced with LCD pins. External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins. Timer pins MAT2[0] and MAT2[1] replaced with LCD pins. USB OTG pins replaced by LCD pins.
LPC2470_2
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Preliminary data sheet
Rev. 02 -- 15 October 2009
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
Table 16. External pin
LCD panel connections for TFT panels TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) LPC2470 pin used LCD function BLUE3 BLUE2 BLUE1 BLUE0 GREEN3 GREEN2 GREEN1 GREEN0 RED3 RED2 RED1 RED0 LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LPC2470 pin used P1[29][4] P1[28][4] P1[27][4] P1[26][4] P2[13][2] P1[25][4] P1[24][4] P1[23][4] P1[22][4] P1[21][4] P1[20][4] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[12][2] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] LCD function BLUE4 BLUE3 BLUE2 BLUE1 BLUE0 GREEN5 GREEN4 GREEN3 GREEN2 GREEN1 GREEN0 RED4 RED3 RED2 RED1 RED0 LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN TFT 16 bit (1:5:5:5 mode) TFT 24 bit LPC2470 pin LCD used function P1[29][4] P1[28][4] P1[27][4] P1[26][4] P2[13][2] P2[12][2] P1[25][4] P1[24][4] P1[23][4] P1[22][4] P1[21][4] P1[20][4] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P4[29][3] P4[28][3] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] P2[11][2] BLUE4 BLUE3 BLUE2 BLUE1 BLUE0 intensity GREEN4 GREEN3 GREEN2 GREEN1 GREEN0 intensity RED4 RED3 RED2 RED1 RED0 intensity LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR LPC2470 pin used P1[29][4] P1[28][4] P1[27][4] P1[26][4] P2[13][2] P2[12][2] P0[9][5] P0[8][5] P1[25][4] P1[24][4] P1[23][4] P1[22][4] P1[21][4] P1[20][4] P0[7][5] P0[6][5] P2[9][1] P2[8][1] P2[7][1] P2[6][1] P4[29][3] P4[28][3] P0[5][5] P0[4][5] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1] LCD function BLUE7 BLUE6 BLUE5 BLUE4 BLUE3 BLUE2 BLUE1 BLUE0 GREEN7 GREEN6 GREEN5 GREEN4 GREEN3 GREEN2 GREEN1 GREEN0 RED7 RED6 RED5 RED4 RED3 RED2 RED1 RED0 LCDLP LCDENAB/L CDM LCDFP LCDDCLK LCDLE LCDPWR LCDCLKIN
LCDVD[23] P1[29][4] LCDVD[22] LCDVD[21] P1[28][4] P1[27][4]
LCDVD[20] P1[26][4] LCDVD[19] LCDVD[18] LCDVD[17] LCDVD[16] LCDVD[15] LCDVD[14] LCDVD[13] P1[25][4] P1[24][4] P1[23][4]
LCDVD[12] P1[22][4] LCDVD[11] LCDVD[10] LCDVD[9] LCDVD[8] LCDVD[7] LCDVD[6] LCDVD[5] LCDVD[4] LCDVD[3] LCDVD[2] LCDVD[1] LCDVD[0] LCDLP LCDENAB/ LCDM LCDFP LCDDCLK LCDLE LCDPWR P2[9][1] P2[8][1] P2[7][1] P2[6][1] P2[5][1] P2[4][1] P2[3][1] P2[2][1] P2[1][1] P2[0][1]
LCDCLKIN P2[11][2]
[1] [2] [3] [4] [5]
LCDCLKIN P2[11][2]
LCDCLKIN P2[11][2]
ETM replaced with LCD pins. External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins. Timer pins MAT2[0] and MAT2[1] replaced with LCD pins. USB OTG pins replaced with LCD pins. I2S pins replaced with LCD pins.
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
11.2 Suggested USB interface solutions
VDD(3V3)
USB_UP_LED USB_CONNECT
LPC24XX
soft-connect switch
R1 1.5 k
VBUS USB_D+ RS = 33 USB_D- RS = 33 VSSIO, VSSCORE
002aad587
USB-B connector
Fig 19. LPC2470 USB interface on a self-powered device
VDD(3V3)
R2
LPC24XX
USB_UP_LED VBUS USB_D+ RS = 33 USB_D- RS = 33 VSSIO, VSSCORE
R1 1.5 k
USB-B connector
002aad588
Fig 20. LPC2470 USB interface on a bus-powered device
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
VDD
R1
R2
R3
R4
RSTOUT
RESET_N ADR/PSW VDD OE_N/INT_N SPEED SUSPEND
R4 R5 R6
VBUS ID DP
33 33
ISP1302
DM
Mini-AB connector
USB_SCL1 USB_SDA1 USB_INT1 USB_D+1 USB_D-1 VDD USB_UP_LED1
R7
SCL SDA INT_N
VSSIO, VSSCORE
LPC24XX
5V IN USB_PPWR2 USB_OVRCR2 ENA
VDD
LM3526-L
OUTA FLAGA
USB_PWRD2 USB_D+2 USB_D-2
33 33 15 k 15 k
VBUS D+ D- VSSIO, VSSCORE USB-A connector
VDD USB_UP_LED2
R8
002aad589
Fig 21. LPC2470 USB OTG port configuration: USB port 1 OTG dual-role device, USB port 2 host
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
VDD
RSTOUT USB_TX_E1 USB_TX_DP1 USB_TX_DM1 USB_RCV1 USB_RX_DP1 USB_RX_DM1 VDD
RESET_N OE_N/INT_N DAT_VP SE0_VM RCV VP VM VBUS ID DP
33 33
ISP1302 LPC24XX
ADR/PSW SPEED SUSPEND
USB MINI-AB connector
DM
VSSIO, VSSCORE
USB_SCL1 USB_SDA1 USB_INT1 VDD USB_UP_LED1
SCL SDA INT_N
002aad590
Fig 22. LPC2470 USB OTG port configuration: VP_VM mode
LPC2470_2
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
VDD USB_UP_LED1 VSSIO, VSSCORE USB_D+1 USB_D-1
33 33 15 k 15 k
D+ D- USB-A connector VDD
USB_PWRD1 USB_OVRCR1 USB_PPWR1 5V IN ENA FLAGA
VBUS
LM3526-L
OUTA
LPC24XX
VDD USB_UP_LED2
VDD USB_CONNECT2 VSSIO, VSSCORE USB_D+2 USB_D-2 VBUS
33 33
D+ D- VBUS USB-B connector
002aad595
Fig 23. LPC2470 USB OTG port configuration: USB port 2 device, USB port 1 host
LPC2470_2
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
VDD USB_UP_LED1 VSSIO, VSSCORE D+ D-
15 k 15 k
USB_D+1 USB_D-1
33 33
USB-A connector VDD
USB_PWRD1 USB_OVRCR1 USB_PPWR1 5V IN ENA FLAGA OUTA VDD
VBUS
LPC24XX
LM3526-L
OUTB FLAGB
USB_PPWR2 USB_OVRCR2 USB_PWRD2
ENB
VBUS
USB_D+2 USB_D-2
33 33 15 k 15 k
D+ D- VSSIO, VSSCORE VDD
USB-A connector
USB_UP_LED2
002aad596
Fig 24. LPC2470 USB OTG port configuration: USB port 1 host, USB port 2 host
11.3 XTAL1 input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mVrms is needed. For more details see the LPC24xx User manual UM10237.
LPC2470_2
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Preliminary data sheet
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LPC2470
Flashless 16-bit/32-bit microcontroller
LPC2xxx
XTAL1
Ci 100 pF Cg
002aae718
Fig 25. Slave mode operation of the on-chip oscillator
11.4 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1 and Cx2, and Cx3 in case of third overtone crystal usage, have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible, in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout.
11.5 Suggested boot memory interface solutions
`a_m' and `a_b' in the following figures refer to the highest order address line of the memory chip and the highest order microcontroller's address line used respectively.
CS1 OE CE OE BLS1 D[15:8] WE IO[7:0] A[a_m:0] 8-bit MEMORY BLS0 D[7:0] CE OE WE IO[7:0] A[a_m:0] 8-bit MEMORY
A[a_b:1]
002aad322
Fig 26. Booting from two 8-bit memory chips
LPC2470_2
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Preliminary data sheet
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LPC2470
Flashless 16-bit/32-bit microcontroller
CS1 OE WE CE OE WE BLS1 BLS0 D[15:0] UB LB IO[15:0] A[a_m:0] 16-bit MEMORY
A[a_b:1]
002aad323
Fig 27. Booting from a single 16-bit memory chip
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
12. Package outline
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1
c
y X
A
156 157 105 104
ZE
e E HE
A A2 A1
(A 3) Lp L detail X
wM bp pin 1 index
208 53 1 52
e
bp D HD
wM
ZD B
vM A
vM B
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 28.1 27.9 E (1) 28.1 27.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.12 w 0.08 y 0.08 ZD 1.43 1.08 ZE 1.43 1.08 7o o 0
30.15 30.15 29.85 29.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT459-1 REFERENCES IEC 136E30 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-02-06 03-02-20
Fig 28. Package outline SOT459-1 (LQFP208)
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Preliminary data sheet
Rev. 02 -- 15 October 2009
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
SOT950-1
D
B
A
ball A1 index area
E
A
A2
A1
detail X
e1 e b v w
M M
CAB C
C y1 C y
U T R P N M L K J H G F E D C B A
e e2
ball A1 index area
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
X
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 1.2 A1 0.4 0.3 A2 0.8 0.6 b 0.5 0.4 D 15.1 14.9 E 15.1 14.9 e 0.8 e1 12.8 e2 12.8 v 0.15 w 0.08 y 0.12 y1 0.1
OUTLINE VERSION SOT950-1
REFERENCES IEC JEDEC --JEITA
EUROPEAN PROJECTION
ISSUE DATE 06-06-01 06-06-14
Fig 29. Package outline SOT950-1 (TFBGA208)
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Preliminary data sheet
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LPC2470
Flashless 16-bit/32-bit microcontroller
13. Abbreviations
Table 17. Acronym ADC AHB AMBA APB BLS BOD CAN DAC DCC DMA EOP ETM GPIO IrDA JTAG LCD MII MIIM OHCI OTG PHY PLL POR PWM RMII SD/MMC SE0 SPI SSI SSP TTL UART USB Acronym list Description Analog-to-Digital Converter Advanced High-performance Bus Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Byte Lane Select BrownOut Detection Controller Area Network Digital-to-Analog Converter Debug Communication Channel Direct Memory Access End Of Packet Embedded Trace Macrocell General Purpose Input/Output Infrared Data Association Joint Test Action Group Liquid Crystal Display Media Independent Interface Media Independent Interface Management Open Host Controller Interface On-The-Go Physical Layer Phase-Locked Loop Power-On Reset Pulse Width Modulator Reduced Media Independent Interface Secure Digital/MultiMediaCard Single Ended Zero Serial Peripheral Interface Synchronous Serial Interface Synchronous Serial Port Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter Universal Serial Bus
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
14. Revision history
Table 18. Revision history Release date 20091015 Data sheet status Preliminary data sheet Change notice Supersedes LPC2470_1 Document ID LPC2470_2 Modifications:
* * * * * * * * *
Table 6: Changed ESD min/max to -2500/+2500. Table 7: Updated conditions and typical values for IDD(DCDC)act(3V3). Table 7: Updated Table note 12. Table 7: Updated min, typical and max values for oscillator pins. Added deep power-down mode information. Added Section 11.3 "XTAL1 input". Figure 21: Changed ISP1301 to ISP1302. Figure 22: Changed ISP1301 to ISP1302. Section 7.26.3 "Brownout detection": Changed VDD(3V3) to VDD(DCDC)(3V3). Preliminary data sheet -
LPC2470_1
20081027
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
15.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V.
16. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC2470_2
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LPC2470
Flashless 16-bit/32-bit microcontroller
17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Functional description . . . . . . . . . . . . . . . . . . 26 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 26 7.2 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 27 7.3 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.4 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 28 7.4.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 29 7.5 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 29 7.6 External memory controller. . . . . . . . . . . . . . . 29 7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.7 General purpose DMA controller . . . . . . . . . . 30 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.8 Fast general purpose parallel I/O . . . . . . . . . . 31 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.9 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 32 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.11 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.11.1 USB device controller . . . . . . . . . . . . . . . . . . . 34 7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.11.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 34 7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.11.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 35 7.11.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.12 CAN controller and acceptance filters . . . . . . 35 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.15 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 37 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 37 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 37 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.19 7.19.1 7.20 7.20.1 7.21 I2C-bus serial I/O controller . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2S-bus serial I/O controllers . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 7.21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 7.22.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 7.23.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 7.24.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25 Clocking and power control . . . . . . . . . . . . . . 7.25.1 Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 7.25.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 7.25.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7.25.1.3 RTC oscillator. . . . . . . . . . . . . . . . . . . . . . . . . 7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 7.25.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 7.25.4.5 Power domains. . . . . . . . . . . . . . . . . . . . . . . . 7.26 System control . . . . . . . . . . . . . . . . . . . . . . . . 7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.26.2 Boot process . . . . . . . . . . . . . . . . . . . . . . . . . 7.26.3 Brownout detection . . . . . . . . . . . . . . . . . . . . 7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.26.5 External interrupt inputs . . . . . . . . . . . . . . . . . 7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 7.27 Emulation and debugging. . . . . . . . . . . . . . . . 7.27.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics . . . . . . . . . . . . . . . . . . . 9.1 Power consumption static characteristics . . . 9.1.1 Deep power-down mode . . . . . . . . . . . . . . . . 9.1.2 Power-down mode . . . . . . . . . . . . . . . . . . . . . 9.2 ADC static characteristics . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 10.1 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information . . . . . . . . . . . . . . . . . 11.1 LCD panel signal usage . . . . . . . . . . . . . . . . . 38 38 38 39 39 39 40 40 41 41 41 42 42 42 42 42 43 43 43 44 44 44 44 45 45 45 45 46 46 46 47 47 47 47 47 48 49 50 53 53 55 57 60 64 67 67
continued >>
LPC2470_2
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Preliminary data sheet
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NXP Semiconductors
LPC2470
Flashless 16-bit/32-bit microcontroller
70 74 75 75 77 79 80 81 81 81 81 81 81 82
11.2 11.3 11.4 11.5 12 13 14 15 15.1 15.2 15.3 15.4 16 17
Suggested USB interface solutions . . . . . . . . XTAL1 input . . . . . . . . . . . . . . . . . . . . . . . . . . XTAL and RTC Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . . . . . . . Suggested boot memory interface solutions. . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 October 2009 Document identifier: LPC2470_2

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